A3P400-1FGG484

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Mfr.Part #
A3P400-1FGG484
Manufacturer
Microsemi
Package / Case
484-BGA
Datasheet
Download
Description
IC FPGA 194 I/O 484FBGA
Stock
28,856
In Stock :
28,856

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Manufacturer :
Microsemi
Product Category :
FPGAs (Field Programmable Gate Array)
Speed Grade :
1
Mounting Type :
Surface Mount
Time@Peak Reflow Temperature-Max (s) :
40
Package / Case :
484-BGA
Number of Gates :
400000
Radiation Hardening :
No
Number of Registers :
9216
RoHS Status :
RoHS Compliant
Series :
ProASIC3
Weight :
400.011771mg
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
JESD-609 Code :
e1
RAM Size :
6.8kB
Base Part Number :
A3P400
Operating Supply Voltage :
1.5V
Peak Reflow Temperature (Cel) :
250
Max Frequency :
272MHz
Terminal Position :
BOTTOM
Number of I/O :
194
Number of Terminations :
484
Terminal Form :
Ball
Lifecycle Status :
OBSOLETE (Last Updated: 3 weeks ago)
Height :
1.73mm
Operating Temperature :
-40°C~100°C TJ
Mount :
Surface Mount
Total RAM Bits :
55296
Supply Voltage :
1.5V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Voltage - Supply :
1.425V~1.575V
Published :
2008
Width :
23mm
Number of Pins :
484
Length :
23mm
Packaging :
Tray
Terminal Finish :
TIN SILVER COPPER
Datasheets
A3P400-1FGG484
Introducing FPGAs (Field Programmable Gate Array) Microsemi A3P400-1FGG484 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:484-BGA, Base Part Number:A3P400, Number of Terminations:484, Operating Temperature:-40°C~100°C TJ, Number of Pins:484, A3P400-1FGG484 pinout, A3P400-1FGG484 datasheet PDF, A3P400-1FGG484 amp .Beyond FPGAs (Field Programmable Gate Array) Microsemi A3P400-1FGG484 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Microsemi A3P400-1FGG484


FPGAs Microsemi A3P400-1FGG484 Overview

Introducing the robust and versatile FPGAs Microsemi A3P400-1FGG484, a high-performance IC FPGA designed by Microsemi to cater to advanced digital circuitry needs. This FPGA is housed in a 484-pin FBGA (Fine Pitch Ball Grid Array) package, making it suitable for dense board layouts where space and thermal management are critical. With 194 I/O pins, it offers ample flexibility for interfacing with other components in complex systems. The A3P400-1FGG484 is engineered to support a variety of applications, particularly in environments requiring high-speed data processing and reliability.

A3P400-1FGG484 Features

The A3P400-1FGG484 FPGA is equipped with numerous features that make it a go-to solution for designers and engineers. Key features include its 194 user I/Os, which provide extensive connectivity options, and its compact 484FBGA package that ensures a minimal footprint while allowing for efficient thermal dissipation. This FPGA is ideal for applications requiring a balanced mix of power efficiency and high performance.

A3P400-1FGG484 Applications

  • Telecommunications: Utilized in network infrastructure equipment for signal processing and data traffic management, enhancing bandwidth and system reliability.
  • Automotive: Acts as a control unit within automotive systems for processing and managing sensor data, contributing to innovations in vehicle automation and safety technologies.
  • Industrial Automation: Employed in control systems to perform real-time processing for machinery and production lines, improving operational efficiency and precision.
  • Consumer Electronics: Integrated into devices such as high-definition televisions and gaming consoles, where it supports advanced graphics processing and user interface management.
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