A3P250L-1FG256I

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Mfr.Part #
A3P250L-1FG256I
Manufacturer
Microsemi
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 157 I/O 256FBGA
Stock
41,637
In Stock :
41,637

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Manufacturer :
Microsemi
Product Category :
FPGAs (Field Programmable Gate Array)
RoHS Status :
Non-RoHS Compliant
Mount :
Surface Mount
Total RAM Bits :
36864
Number of Terminations :
256
Packaging :
Tray
Weight :
400.011771mg
Operating Temperature :
-40°C~100°C TJ
Lifecycle Status :
Obsolete (Last Updated: 1 month ago)
RAM Size :
4.5kB
Number of Pins :
256
Number of I/O :
157
Speed Grade :
1
Series :
ProASIC3L
Peak Reflow Temperature (Cel) :
225
Height :
1.2mm
Base Part Number :
A3P250L
Radiation Hardening :
No
Operating Supply Current :
3mA
Terminal Form :
Ball
Length :
17mm
Number of Registers :
6144
Mounting Type :
Surface Mount
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Position :
BOTTOM
Max Frequency :
892.86MHz
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Package / Case :
256-LBGA
Width :
17mm
Operating Supply Voltage :
1.2V
Number of Gates :
250000
Number of Outputs :
157
Voltage - Supply :
1.14V~1.575V
Supply Voltage :
1.2V
Published :
2009
Terminal Finish :
TIN LEAD/TIN LEAD SILVER
Time@Peak Reflow Temperature-Max (s) :
30
Datasheets
A3P250L-1FG256I
Introducing FPGAs (Field Programmable Gate Array) Microsemi A3P250L-1FG256I from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:256, Operating Temperature:-40°C~100°C TJ, Number of Pins:256, Base Part Number:A3P250L, Mounting Type:Surface Mount, Package / Case:256-LBGA, A3P250L-1FG256I pinout, A3P250L-1FG256I datasheet PDF, A3P250L-1FG256I amp .Beyond FPGAs (Field Programmable Gate Array) Microsemi A3P250L-1FG256I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Microsemi A3P250L-1FG256I


FPGAs Microsemi A3P250L-1FG256I Overview

Discover the robust capabilities of the FPGAs Microsemi A3P250L-1FG256I, an advanced Field Programmable Gate Array (FPGA) designed for critical applications that demand reliability, flexibility, and high-performance. Manufactured by Microsemi, this component features a versatile 256-ball Fine Pitch Ball Grid Array (FBGA) package, making it ideal for space-constrained environments. With its ability to handle 157 I/Os, this FPGA is optimized for a wide range of uses, from digital signal processing to complex system integrations, offering engineers the adaptability needed to drive innovation and efficiency in their electronic designs.

A3P250L-1FG256I Features

  • 157 input/output pins providing extensive interfacing capabilities.
  • 256FBGA package allowing for a compact form factor and high density integrations.
  • Robust design suited for demanding applications requiring high reliability.

A3P250L-1FG256I Applications

  • Communications Infrastructure: Utilized in routers and switches for data flow management and signal integrity.
  • Industrial Automation: Acts as a control unit in manufacturing robots, improving precision and operational efficiency.
  • Consumer Electronics: Integrated into smart home devices, enhancing connectivity and functionality.
  • Automotive Electronics: Used in vehicle control systems for better performance and safety features.
  • Medical Equipment: Helps in the development of diagnostic and treatment machines with high reliability and adaptability requirements.
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