A3P250-2FGG256
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- Mfr.Part #
- A3P250-2FGG256
- Manufacturer
- Microchip Technology
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 157 I/O 256FBGA
- Stock
- 7,640
- In Stock ：
- 7,640
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- Manufacturer :
- Microchip Technology
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Radiation Hardening :
- No
- Number of Gates :
- 250000
- Length :
- 17mm
- Voltage - Supply :
- 1.425V~1.575V
- Operating Temperature :
- 0°C~85°C TJ
- Packaging :
- Tray
- Number of I/O :
- 157
- Max Frequency :
- 310MHz
- Width :
- 17mm
- Min Supply Voltage :
- 1.425V
- Factory Lead Time :
- 18 Weeks
- Mounting Type :
- Surface Mount
- Speed Grade :
- 2
- RoHS Status :
- RoHS Compliant
- Package / Case :
- 256-LBGA
- Total RAM Bits :
- 36864
- Series :
- ProASIC3
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 1 month ago)
- Frequency :
- 310MHz
- Height :
- 1.2mm
- Mount :
- Surface Mount
- Operating Supply Voltage :
- 1.5V
- Base Part Number :
- A3P250
- Min Operating Temperature :
- 0°C
- Max Operating Temperature :
- 70°C
- Number of Registers :
- 6144
- Weight :
- 400.011771mg
- Number of Pins :
- 256
- RAM Size :
- 4.5kB
- Supplier Device Package :
- 256-FPBGA (17x17)
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Max Supply Voltage :
- 1.575V
- Datasheets
- A3P250-2FGG256
FPGAs Microchip Technology A3P250-2FGG256 Overview
The FPGAs Microchip Technology A3P250-2FGG256 is a highly versatile and efficient integrated circuit designed by Microchip Technology, aimed at meeting the demanding needs of modern digital applications. This IC FPGA, encapsulated in a compact 256FBGA package, boasts 157 input/output options, making it exceptionally flexible for various design requirements. It is engineered to support a wide range of applications, from simple logic control to complex computational tasks, providing developers with a powerful tool to enhance system performance and reliability. The FPGAs Microchip Technology A3P250-2FGG256 stands out for its integration capabilities in systems requiring high-speed data processing and significant logic configuration flexibility.
A3P250-2FGG256 Features
The A3P250-2FGG256 FPGA includes several features that make it an attractive choice for designers and engineers. Key features include a 256-ball fine pitch ball grid array (FBGA) package that optimizes board space and enhances thermal management. The device supports a wide range of digital and mixed-signal applications with its comprehensive I/O capabilities. Its programmability allows for on-the-fly alterations and updates, which are crucial for adaptive technology environments and iterative testing processes.
A3P250-2FGG256 Applications
- Consumer Electronics: Used in devices like smartphones and tablets to manage signal processing and data handling, enhancing device responsiveness and feature integration.
- Automotive Systems: Implements control systems and driver-assist features, improving vehicle safety and performance through high-speed real-time processing.
- Industrial Automation: Acts as a control unit in automated manufacturing lines, increasing precision and reliability while reducing downtime.
- Telecommunications: Essential in network equipment for routing and signal integrity tasks, ensuring efficient data flow and connectivity across networks.
- Medical Devices: Facilitates the operation of complex medical imaging systems such as MRIs and CT scanners, contributing to faster and more accurate diagnostics.
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