A3P1000-2FG256

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Mfr.Part #
A3P1000-2FG256
Manufacturer
Microchip Technology
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 177 I/O 256FBGA
Stock
44,263
In Stock :
44,263

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Manufacturer :
Microchip Technology
Product Category :
FPGAs (Field Programmable Gate Array)
JESD-609 Code :
e0
Series :
ProASIC3
Number of Registers :
24576
Voltage - Supply :
1.425V~1.575V
Length :
17mm
Factory Lead Time :
20 Weeks
Radiation Hardening :
No
Peak Reflow Temperature (Cel) :
225
Mounting Type :
Surface Mount
RoHS Status :
Non-RoHS Compliant
Weight :
400.011771mg
Mount :
Surface Mount
Time@Peak Reflow Temperature-Max (s) :
30
Total RAM Bits :
147456
Height Seated (Max) :
1.8mm
Operating Temperature :
0°C~85°C TJ
Terminal Pitch :
1mm
Terminal Form :
Ball
RAM Size :
18kb
Published :
2009
Lifecycle Status :
IN PRODUCTION (Last Updated: 1 month ago)
Number of Terminations :
256
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Max Frequency :
310MHz
Terminal Position :
BOTTOM
Packaging :
Tray
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Width :
17mm
Operating Supply Voltage :
1.5V
Number of I/O :
177
Number of Pins :
256
Terminal Finish :
TIN LEAD/TIN LEAD SILVER
Package / Case :
256-LBGA
Base Part Number :
A3P1000
Supply Voltage :
1.5V
Speed Grade :
2
Number of Gates :
1000000
Datasheets
A3P1000-2FG256
Introducing FPGAs (Field Programmable Gate Array) Microchip Technology A3P1000-2FG256 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Number of Terminations:256, Number of Pins:256, Package / Case:256-LBGA, Base Part Number:A3P1000, A3P1000-2FG256 pinout, A3P1000-2FG256 datasheet PDF, A3P1000-2FG256 amp .Beyond FPGAs (Field Programmable Gate Array) Microchip Technology A3P1000-2FG256 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology A3P1000-2FG256


FPGAs Microchip Technology A3P1000-2FG256 Overview

The A3P1000-2FG256, developed by Microchip Technology, is a high-performance FPGA (Field Programmable Gate Array) designed to meet the evolving demands of modern digital circuits. This device integrates a robust set of features into a compact 256FBGA package, making it highly suitable for applications requiring a blend of high-speed performance, low power consumption, and significant I/O capabilities. The FPGA is engineered for versatility, facilitating efficient design and reconfiguration of logic circuits, thereby speeding up time-to-market and reducing development costs for a wide range of industries. Incorporating the FPGAs Microchip Technology A3P1000-2FG256 into your hardware architecture ensures a scalable solution that adapts to new challenges and opportunities.

A3P1000-2FG256 Features

This FPGA is noted for its 177 I/O pins, which provide ample connectivity for complex designs requiring numerous inputs and outputs. The 256FBGA package is optimized for a reduced footprint on the system board, which is critical for space-constrained applications. The A3P1000-2FG256 supports various logic design configurations, which can be customized to meet specific operational requirements, making it a highly flexible option for designers.

A3P1000-2FG256 Applications

  • Consumer Electronics: Utilized in devices such as smartphones, tablets, and wearable technology to manage signal processing and power management tasks efficiently.
  • Automotive: Integral in advanced driver-assistance systems (ADAS), where it processes input from multiple sensors for features like collision avoidance and lane departure warnings.
  • Telecommunications: Forms the backbone of network devices, handling data processing and signal routing to support high-speed internet and mobile services.
  • Industrial Automation: Deployed in control systems for factories and plants, facilitating real-time processing and control to optimize manufacturing processes.
  • Medical Devices: Critical in medical imaging systems, such as MRI and ultrasound equipment, for processing complex imaging data and supporting diagnostic capabilities.
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