A-TB762-HA08H

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Mfr.Part #
A-TB762-HA08H
Manufacturer
ASSMANN WSW Components
Package / Case
Datasheet
Download
Description
TERM BLK 8P SIDE ENT 7.62MM PCB
Stock
25,270
In Stock :
25,270

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Manufacturer :
ASSMANN WSW Components
Product Category :
Wire to Board
Number of Levels :
1
Pitch :
0.300 7.62mm
Mating Orientation :
Horizontal with Board
Clamp Material - Plating :
Steel, Stainless
Feature :
Interlocking (Side), Lever Actuated
Mounting Type :
Through Hole
Wire Termination :
Screwless
Operating Temperature :
-40°C~115°C
RoHS Status :
ROHS3 Compliant
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Mount :
Through Hole
Packaging :
Bulk
Series :
A-TB762
Housing Material :
Thermoplastic
Plating :
Steel
Wire Gauge (Min) :
14 AWG
Voltage :
300V
Contact Material - Plating :
Brass
Wire Gauge :
14-24 AWG
Published :
2013
Wire Gauge (Max) :
24 AWG
Color :
Green
Factory Lead Time :
23 Weeks
Current :
10A
Positions Per Level :
8
Datasheets
A-TB762-HA08H
Introducing Wire to Board ASSMANN WSW Components A-TB762-HA08H from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Through Hole, Operating Temperature:-40°C~115°C, Voltage:300V, A-TB762-HA08H pinout, A-TB762-HA08H datasheet PDF, A-TB762-HA08H amp .Beyond Wire to Board ASSMANN WSW Components A-TB762-HA08H ,we also offer 1985218, 1984989, 1706714, Our vast inventory has you covered. Contact us now for immediate solutions.



0.300 7.62mm Green Bulk Thermoplastic Through Hole Horizontal with Board Screwless 1 Levels 14-24 AWG A-TB762

A-TB762-HA08H Overview


Through Hole is the type of mounting for the device.To package the product, a Bulk case is used.The product is a member of the A-TB762 Series.It is more powerful in many ways due to its Interlocking (Side), Lever Actuated feature.It is mounted by Through Hole.It operates at an operating temperature of -40°C~115°C.

A-TB762-HA08H Features


A-TB762 series


A-TB762-HA08H Applications


There are a lot of Assmann WSW Components
A-TB762-HA08H Terminal Blocks applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology
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