9FGV1005C112LTGI
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- Mfr.Part #
- 9FGV1005C112LTGI
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- 16-TFLGA Exposed Pad
- Datasheet
- Download
- Description
- IC CLOCK GENERATOR LGA
- Stock
- 48,355
- In Stock ：
- 48,355
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- Clock Generators, PLLs, Frequency Synthesizers
- Number of Circuits :
- 1
- Voltage - Supply :
- 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V
- Package :
- Tape and Reel (TR)
- Ratio - Input:Output :
- 1:3
- Operating Temperature :
- -40°C ~ 85°C (TA)
- Base Product Number :
- 9FGV1005
- Differential - Input:Output :
- No/Yes
- Series :
- PhiClock™
- Divider/Multiplier :
- Yes/No
- PLL :
- yes
- Supplier Device Package :
- 16-LGA (3x3)
- Package / Case :
- 16-TFLGA Exposed Pad
- Product Status :
- Active
- Type :
- Clock Generator
- Frequency - Max :
- 200MHz, 325MHz
- Mounting Type :
- Surface Mount
- Output :
- CML, HCSL, LP-HCSL, LVCMOS, LVDS, LVPECL
- Input :
- HCSL, LVCMOS, LVDS, Crystal
- Datasheets
- 9FGV1005C112LTGI
Clock Generators, PLLs, Frequency Synthesizers Intersil (Renesas Electronics Corporation) 9FGV1005C112LTGI Overview
The Clock Generators, PLLs, Frequency Synthesizers Intersil (Renesas Electronics Corporation) 9FGV1005C112LTGI IC is a state-of-the-art clock generator designed to meet the stringent demands of modern electronic systems. This highly versatile integrated circuit ensures optimal performance with low power consumption and minimal jitter, making it an essential component for any high-speed digital application. Engineered by Renesas, a leader in semiconductor solutions, the 9FGV1005C112LTGI provides a reliable and precise timing solution that can seamlessly integrate into various technological environments, supporting a broad spectrum of applications from consumer electronics to industrial systems.
9FGV1005C112LTGI Features
- Highly accurate clock generation with minimal jitter.
- Low power consumption suitable for energy-efficient designs.
- Compact LGA (Land Grid Array) package ensures reduced footprint on PCBs.
- Flexible configuration options to suit a wide range of applications.
- Robust design capable
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