93LC66AT/ST
- Mfr.Part #
- 93LC66AT/ST
- Manufacturer
- Microchip Technology
- Package / Case
- 8-TSSOP (0.173, 4.40mm Width)
- Datasheet
- Download
- Description
- IC EEPROM 4KBIT SPI 2MHZ 8TSSOP
- Stock
- 27,327
- In Stock :
- 27,327
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- Manufacturer :
- Microchip Technology
- Product Category :
- Memory
- Number of Terminations :
- 8
- Nominal Supply Current :
- 1.5mA
- Package / Case :
- 8-TSSOP (0.173, 4.40mm Width)
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Length :
- 4.4mm
- Height :
- 1 mm
- Subcategory :
- Memory and Data Storage
- Memory Interface :
- SPI
- Mount :
- Surface Mount
- Width :
- 3mm
- Minimum Operating Temperature :
- 0 C
- Serial Bus Type :
- Microwire
- Memory Density :
- 4
- Series :
- --
- Interface Type :
- 3-Wire, Microwire
- Product Category :
- EEPROM
- Product Status :
- Active
- Memory Size :
- 4Kb 512 x 8
- Height Seated (Max) :
- 1.1mm
- Factory Lead Time :
- 6 Weeks
- Published :
- 2000
- Lead Free :
- Lead Free
- Pbfree Code :
- yes
- Density :
- 4 kb
- Supply Voltage-Min (Vsup) :
- 2.5V
- Memory Organization :
- 512 x 8
- Endurance :
- 1000000 Write/Erase Cycles
- Base Part Number :
- 93LC66A
- RoHS :
- Details
- Number of Pins :
- 8
- Mounting Type :
- Surface Mount
- Terminal Pitch :
- 0.65mm
- Package :
- Tape and Reel (TR)
- Standby Current-Max :
- 0.000001A
- Peak Reflow Temperature (Cel) :
- 260
- Base Product Number :
- 93LC66
- Additional Feature :
- 1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS
- Interfaces :
- Serial(Microwire)
- ECCN Code :
- EAR99
- Write Protection :
- SOFTWARE
- Operating Supply Current :
- 1.5 mA
- Terminal Position :
- Dual
- Data Retention :
- 200 Year
- Supplier Device Package :
- 8-TSSOP
- Interface :
- 2-Wire, Serial
- Supply Voltage-Max (Vsup) :
- 6V
- Power Supplies :
- 3/5V
- JESD-609 Code :
- e3
- Product Type :
- EEPROM
- Packaging :
- Tape and Reel (TR)
- Manufacturer :
- Microchip
- Write Cycle Time - Word, Page :
- 6ms
- Number of Functions :
- 1
- Voltage - Supply :
- 2.5V~5.5V
- Programming Voltage :
- 2.5 V to 6 V
- Contact Plating :
- Tin
- Supply Voltage :
- 3V
- Pin Count :
- 8
- Memory Width :
- 8
- Clock Frequency :
- 2MHz
- Maximum Operating Temperature :
- + 70 C
- RoHS Status :
- ROHS3 Compliant
- Organization :
- 512 x 8
- Data Retention Time-Min :
- 200
- Operating Supply Voltage :
- 5.5V
- Brand :
- Microchip Technology
- Radiation Hardening :
- No
- Memory Type :
- Non-Volatile
- Mounting Style :
- SMD/SMT
- Operating Temperature :
- 0°C~70°C TA
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Access Time :
- 6 ms
- Memory Format :
- EEPROM
- Datasheets
- 93LC66AT/ST
Memory Microchip Technology 93LC66AT/ST Overview
Introducing the cutting-edge 93LC66AT/ST EEPROM from Microchip Technology, a pioneer in integrated circuit solutions. This sophisticated EEPROM boasts a capacity of 4KBIT, offering ample storage space for your critical data. Designed with SPI interface, it delivers swift data transfer rates of up to 2MHZ, ensuring efficient performance in demanding applications. Encased in an 8TSSOP package, it ensures easy integration into your systems, saving both space and effort.
93LC66AT/ST Features
- 4KBIT capacity for extensive data storage
- SPI interface for high-speed data transfer up to 2MHZ
- Compact 8TSSOP package for easy integration
- Robust EEPROM technology for reliable data retention
- Low power consumption for energy-efficient operation
- Wide operating voltage range for versatile compatibility
93LC66AT/ST Applications
- Industrial Automation: Utilize the 93LC66AT/ST EEPROM in industrial automation systems for storing configuration settings, calibration data, and event logs, ensuring seamless operation and maintenance.
- Embedded Systems: Incorporate the 93LC66AT/ST EEPROM into embedded systems for storing firmware, user preferences, and sensor data, enabling efficient boot-up and system customization.
- Consumer Electronics: Integrate the 93LC66AT/ST EEPROM into consumer electronics such as smart appliances and IoT devices for data logging, device configuration, and firmware updates, enhancing user experience and functionality.
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