93LC66AT-I/MC

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Mfr.Part #
93LC66AT-I/MC
Manufacturer
Microchip Technology
Package / Case
8-VFDFN Exposed Pad
Datasheet
Download
Description
IC EEPROM 4KBIT SPI 2MHZ 8DFN
Stock
17,112
In Stock :
17,112

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Manufacturer :
Microchip Technology
Product Category :
Memory
Interface Type :
3-Wire, Microwire
Terminal Finish :
Matte Tin (Sn)
Memory Width :
8
Operating Supply Voltage :
5V
Height Seated (Max) :
1mm
Time@Peak Reflow Temperature-Max (s) :
40
RoHS Status :
ROHS3 Compliant
Supply Voltage-Min (Vsup) :
2.5 V
Data Retention Time-Min :
200
Factory Lead Time :
6 Weeks
Base Part Number :
93LC66A
Write Cycle Time-Max (tWC) :
6ms
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Product Type :
EEPROM
Voltage - Supply :
2.5V~5.5V
Packaging :
Tape and Reel (TR)
Density :
4 kb
Seated Height-Max :
1 mm
JESD-30 Code :
R-PDSO-N8
Nominal Supply Current :
2mA
RoHS :
Details
Operating Temperature :
-40°C~85°C TA
Height :
0.88 mm
Supplier Device Package :
8-DFN (2x3)
Memory Organization :
512 x 8
Package Shape :
RECTANGULAR
Number of Terminations :
8
Supply Voltage :
3V
Radiation Hardening :
No
Endurance :
1000000 Write/Erase Cycles
Write Protection :
SOFTWARE
Memory IC Type :
EEPROM
Peak Reflow Temperature (Cel) :
260
Pin Count :
8
Clock Frequency :
2MHz
Memory Format :
EEPROM
Terminal Pitch :
0.65mm
Memory Size :
4Kb 512 x 8
Subcategory :
Memory and Data Storage
Series :
--
Organization :
512 x 8
Mounting Style :
SMD/SMT
Write Cycle Time - Word, Page :
6ms
Number of Terminals :
8
Mounting Type :
Surface Mount
Terminal Form :
NO LEAD
Product Status :
Active
Access Time :
250 ns
Serial Bus Type :
Microwire
HTS Code :
8542.32.00.51
Surface Mount :
yes
Product Category :
EEPROM
Number of Words :
512 words
Manufacturer :
Microchip
Interfaces :
Serial(Microwire)
Memory Type :
Non-Volatile
Length :
3mm
Mount :
Surface Mount
Standby Current-Max :
0.000001A
Power Supplies :
3/5 V
Package / Case :
8-VFDFN Exposed Pad
ECCN Code :
EAR99
Supply Voltage-Max (Vsup) :
5.5 V
Pbfree Code :
yes
JESD-609 Code :
e3
Maximum Operating Temperature :
+ 85 C
Terminal Position :
Dual
Width :
2.9mm
Parallel/Serial :
Serial
Interface :
Serial
Supply Current-Max :
0.002 mA
Data Retention :
200 Year
Temperature Grade :
Industrial
Qualification Status :
Not Qualified
Operating Supply Current :
2 mA
Published :
2008
Package :
Tape and Reel (TR)
Base Product Number :
93LC66
Contact Plating :
Tin
Minimum Operating Temperature :
- 40 C
Number of Pins :
8
Operating Mode :
SYNCHRONOUS
Memory Interface :
SPI
Lead Free :
Lead Free
Brand :
Microchip Technology / Atmel
Reach Compliance Code :
Compliant
Memory Density :
4
Number of Functions :
1
Datasheets
93LC66AT-I/MC
Introducing Memory Microchip Technology 93LC66AT-I/MC from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:93LC66A, Operating Temperature:-40°C~85°C TA, Number of Terminations:8, Mounting Type:Surface Mount, Package / Case:8-VFDFN Exposed Pad, Number of Pins:8, 93LC66AT-I/MC pinout, 93LC66AT-I/MC datasheet PDF, 93LC66AT-I/MC amp .Beyond Memory Microchip Technology 93LC66AT-I/MC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology 93LC66AT-I/MC


Memory Microchip Technology 93LC66AT-I/MC Overview

Introducing the 93LC66AT-I/MC, an exceptional EEPROM IC meticulously crafted by Microchip Technology. This cutting-edge component boasts a capacity of 4KBIT, seamlessly interfacing via SPI at an impressive rate of 2MHz. Encased in an 8DFN package, it epitomizes reliability, efficiency, and versatility, making it a quintessential choice for diverse applications.

93LC66AT-I/MC Features

  • 4KBIT capacity for ample data storage
  • High-speed SPI interface operating at 2MHz
  • Compact and durable 8DFN package
  • Wide compatibility for seamless integration
  • Low power consumption for energy efficiency
  • Robust reliability ensuring long-term performance

93LC66AT-I/MC Applications

  • Embedded Systems: Utilized in microcontrollers, IoT devices, and industrial automation systems for storing critical configuration data and firmware updates. Its compact size and high reliability make it ideal for space-constrained environments.
  • Consumer Electronics: Integrated into smart home appliances, wearable devices, and consumer gadgets for storing user preferences, device settings, and application data. Its high-speed SPI interface facilitates seamless data transfer, enhancing user experience.
  • Automotive Electronics: Deployed in automotive ECUs, dashboard displays, and infotainment systems for storing vehicle diagnostics, calibration data, and multimedia files. Its rugged design and low power consumption ensure optimal performance in harsh automotive environments.
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