93LC56CT-E/MNY
- Mfr.Part #
- 93LC56CT-E/MNY
- Manufacturer
- Microchip Technology
- Package / Case
- 8-WFDFN Exposed Pad
- Datasheet
- Download
- Description
- IC EEPROM 2KBIT SPI 3MHZ 8TDFN
- Stock
- 34,559
- In Stock :
- 34,559
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- Manufacturer :
- Microchip Technology
- Product Category :
- Memory
- Density :
- 2 kb
- Published :
- 2011
- Supplier Device Package :
- 8-TDFN (2x3)
- Write Cycle Time - Word, Page :
- 6ms
- Subcategory :
- Memory and Data Storage
- Factory Lead Time :
- 6 Weeks
- Number of Terminals :
- 8
- Number of Functions :
- 1
- Number of Words :
- 128 words
- RoHS Status :
- ROHS3 Compliant
- Interface :
- SPI, Serial
- Mounting Style :
- SMD/SMT
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Maximum Operating Temperature :
- + 125 C
- Memory Density :
- 2
- Peak Reflow Temperature (Cel) :
- 260
- Height :
- 800μm
- Brand :
- Microchip Technology
- Supply Voltage :
- 5V
- Supply Voltage-Min (Vsup) :
- 2.5V
- Memory Organization :
- 256 x 8, 128 x 16
- Base Product Number :
- 93LC56
- Data Retention :
- 200 Year
- Serial Bus Type :
- Microwire
- RoHS :
- Details
- Length :
- 3mm
- Organization :
- 256 x 8/128 x 16
- Memory Width :
- 16
- JESD-609 Code :
- e4
- Access Time :
- 250 ns
- Terminal Pitch :
- 0.5mm
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Max Operating Temperature :
- 125 °C
- Series :
- --
- Max Frequency :
- 3 MHz
- Pin Count :
- 8
- Frequency :
- 3 MHz
- Voltage - Supply :
- 2.5V~5.5V
- Lifecycle Status :
- Production (Last Updated: 2 years ago)
- Number of Terminations :
- 8
- Operating Mode :
- SYNCHRONOUS
- Nominal Supply Current :
- 2mA
- Temperature Grade :
- Automotive
- Screening Level :
- TS 16949
- Min Operating Temperature :
- -40 °C
- Supply Voltage-Max (Vsup) :
- 5.5V
- Memory Interface :
- SPI
- Min Supply Voltage :
- 2.5 V
- Product Type :
- EEPROM
- Product Category :
- EEPROM
- Product Status :
- Active
- Packaging :
- Tape and Reel (TR)
- HTS Code :
- 8542.32.00.51
- Memory Size :
- 2Kb 256 x 8 128 x 16
- Memory Format :
- EEPROM
- Terminal Finish :
- Nickel/Palladium/Gold (Ni/Pd/Au)
- Terminal Position :
- Dual
- Package / Case :
- 8-WFDFN Exposed Pad
- Memory IC Type :
- EEPROM
- Package Shape :
- RECTANGULAR
- Interface Type :
- 3-Wire, Microwire
- Seated Height-Max :
- 0.8 mm
- Clock Frequency :
- 3MHz
- Surface Mount :
- yes
- Contact Plating :
- Gold
- Write Cycle Time-Max (tWC) :
- 6ms
- Parallel/Serial :
- Serial
- Mount :
- Surface Mount
- Number of Pins :
- 8
- Minimum Operating Temperature :
- - 40 C
- Package :
- Tape and Reel (TR)
- Memory Type :
- Non-Volatile
- Interfaces :
- Serial(Microwire)
- Operating Temperature :
- -40°C~125°C TA
- Manufacturer :
- Microchip
- Alternate Memory Width :
- 8
- Terminal Form :
- NO LEAD
- Base Part Number :
- 93LC56C
- ECCN Code :
- EAR99
- Reach Compliance Code :
- Compliant
- Max Supply Voltage :
- 5.5 V
- Width :
- 2mm
- Ambient Temperature Range High :
- 125°C
- JESD-30 Code :
- R-PDSO-N8
- Mounting Type :
- Surface Mount
- Datasheets
- 93LC56CT-E/MNY

[Memory Microchip Technology 93LC56CT-E/MNY] Overview
Introducing the cutting-edge 93LC56CT-E/MNY EEPROM, meticulously crafted by Microchip Technology, a leading name in the realm of integrated circuits. This state-of-the-art EEPROM, boasting a capacity of 2KBIT, operates seamlessly via SPI, ensuring lightning-fast speeds of up to 3MHZ. Encased in an 8TDFN package, this compact yet powerful component redefines efficiency and reliability in memory storage solutions.
[93LC56CT-E/MNY] Features
- 2KBIT EEPROM
- SPI Interface
- Operational Frequency: 3MHZ
- Compact 8TDFN Package
[93LC56CT-E/MNY] Applications
- Automotive Electronics: Employed in automotive electronics for storing critical data such as vehicle parameters, user preferences, and error logs, ensuring seamless operation and diagnostic capabilities.
- Industrial Control Systems: Integrated into industrial control systems to facilitate data logging, configuration storage, and firmware updates, enhancing operational efficiency and reliability.
- Consumer Electronics: Utilized in consumer electronics devices such as smart appliances, wearable gadgets, and IoT devices for storing configuration settings, user profiles, and application data, enabling personalized experiences and seamless connectivity.
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