89HT0816APZCBLGI

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Mfr.Part #
89HT0816APZCBLGI
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
196-BBGA, FCBGA
Datasheet
Download
Description
IC INTFACE SPECIALIZED 196FCBGA
Stock
102
In Stock :
102

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Specialized
Interface :
I2C
Factory Lead Time :
20 Weeks
RoHS Status :
ROHS3 Compliant
Applications :
Signal Retimer
Package / Case :
196-BBGA, FCBGA
Packaging :
Tray
Mounting Type :
Surface Mount
Moisture Sensitivity Level (MSL) :
2A (4 Weeks)
Datasheets
89HT0816APZCBLGI
Introducing Specialized Intersil (Renesas Electronics Corporation) 89HT0816APZCBLGI from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:196-BBGA, FCBGA, Mounting Type:Surface Mount, 89HT0816APZCBLGI pinout, 89HT0816APZCBLGI datasheet PDF, 89HT0816APZCBLGI amp .Beyond Specialized Intersil (Renesas Electronics Corporation) 89HT0816APZCBLGI ,we also offer DS90CR285MTDX/NOPB, USB2640I-HZH-02, LTC4316CMS#PBF, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 89HT0816APZCBLGI


Specialized Intersil (Renesas Electronics Corporation) 89HT0816APZCBLGI Overview

The Specialized Intersil (Renesas Electronics Corporation) 89HT0816APZCBLGI is an advanced interface IC designed for high-performance data transfer and management applications within computing and networking infrastructures. This component, housed in a 196FCBGA package, facilitates robust, reliable communications in complex electronic systems. Its design focuses on enhancing data integrity and speed, making it an essential choice for developers looking to improve system efficiency and connectivity.

89HT0816APZCBLGI Features

The 89HT0816APZCBLGI IC comes equipped with specialized interface capabilities that support high-speed data transactions and connectivity enhancements. It is built to handle intensive bandwidth demands, providing high reliability and performance in data-intensive operations. The compact 196FCBGA packaging ensures that it can be integrated into space-constrained environments while maintaining optimal thermal performance.

89HT0816APZCBLGI Applications

  • Data Centers: Enables robust data management and communication between servers, improving throughput and system reliability.
  • High-Performance Computing: Facilitates high-speed data transfers necessary for computational analysis and processing in scientific and financial applications.
  • Networking Equipment: Critical for use in routers and switches, improving bandwidth and data flow management across network layers.
  • Storage Systems: Enhances interface connections between storage devices, optimizing access and data transfer rates for enterprise-level storage solutions.
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Shipping Method

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Shipping Cost

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