89HPES24T6G2ZBALG
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- Mfr.Part #
- 89HPES24T6G2ZBALG
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- FCBGA
- Datasheet
- Download
- Description
- IC INTFACE SPECIALIZED 324FCBGA
- Stock
- 40,858
- In Stock ：
- 40,858
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- Specialized
- Mount :
- Surface Mount
- Lead Free :
- Lead Free
- Supply Voltage-Max (Vsup) :
- 1.1V
- Pin Count :
- 324
- Contact Plating :
- Copper, Silver, Tin
- ECCN Code :
- EAR99
- Number of Terminations :
- 324
- Thickness :
- 3.27mm
- Peak Reflow Temperature (Cel) :
- 260
- Clock Frequency :
- 125MHz
- Length :
- 19mm
- Factory Lead Time :
- 10 Weeks
- Terminal Position :
- BOTTOM
- JESD-609 Code :
- e1
- Terminal Form :
- Ball
- Published :
- 1999
- Power Supplies :
- 13.3V
- Terminal Pitch :
- 1mm
- RoHS Status :
- RoHS Compliant
- Width :
- 19mm
- Package / Case :
- FCBGA
- Qualification Status :
- Not Qualified
- Supply Voltage :
- 1V
- Bus Compatibility :
- PCI
- Min Operating Temperature :
- 0°C
- uPs/uCs/Peripheral ICs Type :
- BUS CONTROLLER, PCI
- Pbfree Code :
- yes
- Max Operating Temperature :
- 70°C
- Height Seated (Max) :
- 3.42mm
- HTS Code :
- 8542.39.00.01
- Supply Voltage-Min (Vsup) :
- 0.9V
- Interface :
- PCI Express
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Number of Pins :
- 324
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Temperature Grade :
- COMMERCIAL
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Datasheets
- 89HPES24T6G2ZBALG
Specialized Intersil (Renesas Electronics Corporation) 89HPES24T6G2ZBALG Overview
The Specialized Intersil (Renesas Electronics Corporation) 89HPES24T6G2ZBALG is an advanced interface IC, meticulously engineered for specialized applications. Housed in a compact 324-pin FCBGA package, this chip is designed to optimize the reliability and performance of communication and network systems. Its robust architecture allows for seamless integration into sophisticated electronic environments, making it an essential component for developers looking to enhance system capabilities with cutting-edge technology.
89HPES24T6G2ZBALG Features
This IC excels in delivering high-speed signal integrity and increased data throughput, with minimal latency. The 324FCBGA package ensures a compact footprint along with superior thermal management, which is critical for maintaining performance in tightly packed system designs. Additionally, the IC's specialized interface functionalities make it ideal for managing complex data streams in high-demand applications.
89HPES24T6G2ZBALG Applications
- Data Centers: Enhances server connectivity and manages high-volume, high-speed data transfers effectively.
- Telecommunications Equipment: Acts as a backbone for routing and signal integrity solutions in multiplexers and switches.
- Network Attached Storage Devices: Improves data access speed and reliability for storage systems connected to network infrastructures.
- Industrial Automation Systems: Integrates into control units for real-time processing and communication in automated production lines.
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