89H32H8G3YCHLI8

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Mfr.Part #
89H32H8G3YCHLI8
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
484-BBGA
Datasheet
Download
Description
IC INTFACE SPECIALIZED 484FCBGA
Stock
27,988
In Stock :
27,988

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Specialized
Applications :
Switch Interfacing
Interface :
PCI Express
Packaging :
Tape and Reel (TR)
Mounting Type :
Surface Mount
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Package / Case :
484-BBGA
Datasheets
89H32H8G3YCHLI8
Introducing Specialized Intersil (Renesas Electronics Corporation) 89H32H8G3YCHLI8 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:484-BBGA, 89H32H8G3YCHLI8 pinout, 89H32H8G3YCHLI8 datasheet PDF, 89H32H8G3YCHLI8 amp .Beyond Specialized Intersil (Renesas Electronics Corporation) 89H32H8G3YCHLI8 ,we also offer DS90CR285MTDX/NOPB, USB2640I-HZH-02, LTC4316CMS#PBF, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 89H32H8G3YCHLI8


Specialized Intersil (Renesas Electronics Corporation) 89H32H8G3YCHLI8 Overview

The Specialized Intersil (Renesas Electronics Corporation) 89H32H8G3YCHLI8 IC Interface Specialized unit is a high-performance solution designed for advanced interface applications. Encased in a 484 FCBGA package, this IC ensures robust operational efficiency and is tailored to meet the high reliability and flexibility demands of specialized interface environments. Its integration in complex digital systems highlights its capability to streamline communication and enhance data transfer rates, making it a prime choice for B2B clients aiming for system upgrades or constructing state-of-the-art technology frameworks.

89H32H8G3YCHLI8 Features

This IC is equipped with multiple features that ensure its optimal performance in a variety of demanding applications. Key features include advanced signal integrity, high data throughput, and low-latency processing capabilities. Its compact 484-pin FCBGA (Fine Pitch Ball Grid Array) package allows for efficient heat dissipation and reduced footprint on the system board, which is critical for high-density electronic assemblies.

89H32H8G3YCHLI8 Applications

  • Data Centers: Utilized in server motherboard designs for enhanced data communication interfaces, ensuring rapid data processing and reliability under continuous operation.
  • Telecommunication Equipment: Acts as a critical component in telecommunications infrastructure, supporting high-speed data transmission and connectivity enhancements.
  • Advanced Computing Systems: Integral to the development of complex computing systems, facilitating improved interface communications between core processing units and peripheral devices.
  • Industrial Automation: Employs in control systems for industrial automation, improving interface reliability and speed, which are vital for real-time operation and monitoring.
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Shipping Method

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Shipping Cost

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The basic freight (for package ≤0.5 KG ) depends on the time zones and countries

Delivery Time

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