857-035-553-104

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Mfr.Part #
857-035-553-104
Manufacturer
EDAC Inc.
Package / Case
Datasheet
Download
Description
CONN EDGE DUAL FMALE 70POS 0.156
Stock
19,403
In Stock :
19,403

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Manufacturer :
EDAC Inc.
Product Category :
Edgeboard Connectors
Series :
857
Gender :
FEMALE
Operating Temperature :
-40°C ~ 125°C
Color :
Black
Product Status :
Active
Housing Material :
Polyphenylene Sulfide (PPS)
Number of Rows :
2
Number of Positions :
70
Card Thickness :
0.054 ~ 0.070 (1.37mm ~ 1.78mm)
Flange Feature :
Flush Mount, Top Opening, Unthreaded, 0.156 (3.96mm) Dia
Base Product Number :
857-035
Material - Insulation :
Polyphenylene Sulfide (PPS)
Product :
Receptacles
Mounting Type :
Through Hole, Right Angle
Contact Plating :
Gold
Mounting Style :
Panel Mount
Number of Positions/Bay/Row :
35
Package :
Bulk
Termination :
Solder
Contact Finish :
Gold
Card Type :
Non Specified - Dual Edge
Contact Type :
Semi Bellows
Read Out :
Dual
Pitch :
0.156 (3.96mm)
Features :
-
Board Thickness :
1.57 mm
Mounting Angle :
RIGHT ANGLE
Contact Material :
COPPER ALLOY
Contact Finish Thickness :
10.0µin (0.25µm)
Datasheets
857-035-553-104
Introducing Edgeboard Connectors EDAC Inc. 857-035-553-104 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C ~ 125°C, Mounting Type:Through Hole, Right Angle, 857-035-553-104 pinout, 857-035-553-104 datasheet PDF, 857-035-553-104 amp .Beyond Edgeboard Connectors EDAC Inc. 857-035-553-104 ,we also offer SM3ZS067U215AER1500, 1759547-1, 1-2199230-6, Our vast inventory has you covered. Contact us now for immediate solutions.

EDAC Inc. 857-035-553-104


Female Black 0.156 (3.96mm) Copper Alloy 2 Rows Solder Gold 70 Positions Polyphenylene Sulfide (PPS)

857-035-553-104 Overview


You should mount it type Through Hole, Right Angle.857 indicates that the device belongs to the series.

857-035-553-104 Features


857 series


857-035-553-104 Applications


There are a lot of EDAC
857-035-553-104 Edgeboard Connectors applications.


  • CMOS Image sensors for mobile applications
  • Medical Instrumentation and medical imaging
  • Music recording
  • Digital signal processing
  • Scientific instruments
  • Rotary encoder
  • Displaying
  • Transducer
  • Microcontrollers.
  • Digital Storage Oscilloscope
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