82P2821BH

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Mfr.Part #
82P2821BH
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
640-BGA Exposed Pad
Datasheet
Download
Description
IC TELECOM INTERFACE 640TEPBGA
Stock
3,105
In Stock :
3,105

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Telecom
Number of Circuits :
1
Packaging :
Tray
Package / Case :
640-BGA Exposed Pad
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Function :
Line Interface Unit (LIU)
Voltage - Supply :
1.8V 3.3V
Factory Lead Time :
12 Weeks
Base Part Number :
IDT82P2821
Interface :
E1, J1, T1
Mounting Type :
Surface Mount
RoHS Status :
Non-RoHS Compliant
Operating Temperature :
-40°C~85°C
Datasheets
82P2821BH
Introducing Telecom Intersil (Renesas Electronics Corporation) 82P2821BH from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:640-BGA Exposed Pad, Base Part Number:IDT82P2821, Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C, 82P2821BH pinout, 82P2821BH datasheet PDF, 82P2821BH amp .Beyond Telecom Intersil (Renesas Electronics Corporation) 82P2821BH ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.



IDT82P2821 Telecom device 1 Circuits

82P2821BH Overview


A 640-BGA Exposed Pad package is used to reduce board space requirements.A Tray-packing method is used to pack telecommunications equipment.A Surface Mount-mount is used for mounting the telecom circuit.Telecom circuit is made up of 1 circuits.Providing 1.8V 3.3V wtelecom IC's efficiencyh the correct supply voltage will improve efficiency.A -40°C~85°C-temperature setting offers reliable performance.The IDT82P2821 base part number can be used to find more related parts.

82P2821BH Features


Available in the 640-BGA Exposed Pad package


82P2821BH Applications


There are a lot of Renesas Electronics America Inc.
82P2821BH Telecom applications.


  • Fractional T1/E1/J1
  • BITS Timing
  • Digital Access Cross-connect System (DACs)
  • Digital Cross-connect Systems (DCS)
  • Frame Relay Switches and Access Devices (FRADS)
  • ISDN Primary Rate Interfaces (PRA)
  • PBXs channel bank
  • PCM channel bank
  • T3 channelized access concentrators
  • M13 MUX
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