808-AG12D-ES
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- Mfr.Part #
- 808-AG12D-ES
- Manufacturer
- TE Connectivity AMP Connectors
- Package / Case
- Datasheet
- Download
- Description
- CONN IC DIP SOCKET 8POS TIN-LEAD
- Stock
- 40,481
- In Stock ：
- 40,481
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- * Fullname:
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- Manufacturer :
- TE Connectivity AMP Connectors
- Product Category :
- IC Sockets
- ECCN Code :
- EAR99
- Contact Finish - Post :
- --
- Contact Material :
- NOT SPECIFIED
- Product Status :
- Active
- Mounting Type :
- Through Hole
- Current Rating :
- 3A
- Reach Compliance Code :
- Compliant
- Operating Temperature :
- -55°C ~ 105°C
- Device Socket Type :
- IC SOCKET
- Pitch - Post :
- 0.100 (2.54mm)
- PCB Contact Row Spacing :
- 0.3 mm
- PCB Contact Pattern :
- RECTANGULAR
- Number of Positions or Pins (Grid) :
- 8 (2 x 4)
- Contact Material - Mating :
- COPPER ALLOY
- Contact Resistance :
- 10 MOhm
- Mounting Style :
- Straight
- Termination :
- Solder
- HTS Code :
- 8536.69.40.40
- Contact Finish Thickness - Post :
- --
- Pbfree Code :
- No
- Contact Material - Post :
- --
- Contact Finish Thickness - Mating :
- --
- Contact Finish - Mating :
- Tin-Lead
- Termination Type :
- Solder
- Series :
- 800
- Device Type Used On :
- DIP8
- Package :
- Tube
- Contact Style :
- RND PIN-SKT
- Mating Contact Pitch :
- 0.1 inch
- Pitch - Mating :
- 0.100 (2.54mm)
- Terminal Pitch :
- 2.54 mm
- Type :
- DIP, 0.3 (7.62mm) Row Spacing
- Base Product Number :
- 808
- Number of Contacts :
- 8
- Current Rating (Amps) :
- 3 A
- Termination Post Length :
- 0.125 (3.18mm)
- Housing Material :
- POLYETHYLENE POLYESTER
- Body Depth :
- 0.18 inch
- Material Flammability Rating :
- UL94 V-0
- Packaging :
- Tube
- Features :
- Open Frame
- Datasheets
- 808-AG12D-ES
808-AG12D-ES datasheet pdf and Connectors, Interconnects product details from TE Connectivity AMP Connectors stock available at Xinshop
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The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
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