807-022-458-107

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Mfr.Part #
807-022-458-107
Manufacturer
EDAC Inc.
Package / Case
Datasheet
Download
Description
CONN EDGE SGL FML 22POS 0.156
Stock
6,918
In Stock :
6,918

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Manufacturer :
EDAC Inc.
Product Category :
Edgeboard Connectors
Termination :
Solder
Contact Finish Thickness :
-
Color :
Green
Number of Positions/Bay/Row :
22
Board Thickness :
1.57 mm
Operating Temperature :
-40°C ~ 125°C
Mounting Type :
Through Hole, Right Angle
Gender :
FEMALE
Series :
807
Product :
Receptacles
Contact Finish :
Tin
Housing Material :
Diallyl Phthalate (DAP)
Card Type :
Non Specified - Single Edge
Contact Material :
COPPER ALLOY
Base Product Number :
807-022
Number of Rows :
1
Card Thickness :
0.054 ~ 0.070 (1.37mm ~ 1.78mm)
Mounting Style :
Panel Mount
Features :
-
Read Out :
Single
Mounting Angle :
RIGHT ANGLE
Package :
Bulk
Pitch :
0.156 (3.96mm)
Contact Type :
Semi Bellows
Number of Positions :
22
Contact Plating :
Gold
Material - Insulation :
Diallyl Phthalate (DAP)
Product Status :
Active
Flange Feature :
Flush Mount, Top Opening, Threaded Insert, M3
Datasheets
807-022-458-107
Introducing Edgeboard Connectors EDAC Inc. 807-022-458-107 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C ~ 125°C, Mounting Type:Through Hole, Right Angle, 807-022-458-107 pinout, 807-022-458-107 datasheet PDF, 807-022-458-107 amp .Beyond Edgeboard Connectors EDAC Inc. 807-022-458-107 ,we also offer SM3ZS067U215AER1500, 1759547-1, 1-2199230-6, Our vast inventory has you covered. Contact us now for immediate solutions.

EDAC Inc. 807-022-458-107


Female Green 0.156 (3.96mm) Copper Alloy 1 Rows Solder Tin 22 Positions Diallyl Phthalate (DAP)

807-022-458-107 Overview


It's best to mount type Through Hole, Right Angle.The 807 indicates the series number of the device.

807-022-458-107 Features


807 series


807-022-458-107 Applications


There are a lot of EDAC
807-022-458-107 Edgeboard Connectors applications.


  • RADAR processing, digital oscilloscopes
  • CMOS Image sensors for mobile applications
  • Medical Instrumentation and medical imaging
  • Music recording
  • Digital signal processing
  • Scientific instruments
  • Rotary encoder
  • Displaying
  • Transducer
  • Microcontrollers.
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