74LVC2G17GN,132

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Mfr.Part #
74LVC2G17GN,132
Manufacturer
NXP Semiconductors
Package / Case
6-XFDFN
Datasheet
Download
Description
IC BUFFER NON-INVERT 5.5V 6XSON
Stock
14,290
In Stock :
14,290

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Manufacturer :
NXP Semiconductors
Product Category :
Buffers, Drivers, Receivers, Transceivers
Terminal Pitch :
0.3mm
Voltage - Supply :
1.65V~5.5V
Terminal Position :
Dual
Supply Voltage-Max (Vsup) :
5.5V
Package / Case :
6-XFDFN
Number of Pins :
6
Height Seated (Max) :
0.35mm
RoHS Status :
ROHS3 Compliant
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Mounting Type :
Surface Mount
Series :
74LVC
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Base Part Number :
74LVC2G17
Max Power Dissipation :
300mW
Polarity :
Non-Inverting
Logic Type :
Buffer, Non-Inverting
Pin Count :
6
Number of Bits per Element :
1
Logic Function :
Buffer, Schmitt Trigger
Supply Voltage :
3.3V
Number of Terminations :
6
Input Type :
Schmitt Trigger
JESD-609 Code :
e3
Nominal Supply Current :
40μA
Factory Lead Time :
13 Weeks
Terminal Finish :
Tin (Sn)
Mount :
Surface Mount
Width :
0.9mm
Packaging :
Tape and Reel (TR)
Family :
LVC/LCX/Z
Quiescent Current :
40μA
Output Type :
Push-Pull
Current - Output High, Low :
32mA 32mA
Number of Functions :
2
Propagation Delay :
5.6 ns
Number of Output Lines :
2
Terminal Form :
NO LEAD
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Operating Temperature :
-40°C~125°C TA
Datasheets
74LVC2G17GN,132
Introducing Buffers, Drivers, Receivers, Transceivers NXP Semiconductors 74LVC2G17GN,132 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:6-XFDFN, Number of Pins:6, Mounting Type:Surface Mount, Base Part Number:74LVC2G17, Number of Terminations:6, Operating Temperature:-40°C~125°C TA, 74LVC2G17GN,132 pinout, 74LVC2G17GN,132 datasheet PDF, 74LVC2G17GN,132 amp .Beyond Buffers, Drivers, Receivers, Transceivers NXP Semiconductors 74LVC2G17GN,132 ,we also offer SN74LVC244APWR, SN74AUP1G07DCKR, SN74LVC2G125DCUR, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors 74LVC2G17GN,132


Buffers, Drivers, Receivers, Transceivers NXP Semiconductors 74LVC2G17GN,132 Overview

Introducing the 74LVC2G17GN,132, an innovative Integrated Circuit (IC) buffer designed by NXP Semiconductors, a pioneer in semiconductor technology. This compact yet powerful buffer offers non-inverting functionality with a voltage tolerance of up to 5.5V, making it an ideal choice for a wide range of applications in electronic circuits.

Engineered with precision and reliability in mind, the 74LVC2G17GN,132 ensures seamless signal buffering, enhancing the performance and efficiency of your electronic systems. Whether you're designing complex digital circuits or implementing signal conditioning solutions, this versatile IC delivers exceptional results, meeting the stringent demands of modern electronics.

With its compact 6XSON package, this IC offers space-saving advantages without compromising on performance, making it suitable for integration into various electronic devices and systems. Experience the reliability and performance you expect from NXP Semiconductors with the 74LVC2G17GN,132.

74LVC2G17GN,132 Features

  • Non-inverting buffer IC
  • Operating voltage range: 1.65V to 5.5V
  • High-speed operation: up to 32 MHz
  • Low power consumption
  • Compact 6XSON package
  • Wide temperature range: -40°C to +125°C
  • Excellent noise immunity
  • Industry-leading reliability

74LVC2G17GN,132 Applications

  • Industrial automation: Utilized in PLCs (Programmable Logic Controllers) for signal buffering and voltage level shifting, ensuring stable and reliable operation in harsh industrial environments.
  • Communication systems: Integrated into data transmission equipment, such as routers and switches, to enhance signal integrity and minimize data loss over long distances.
  • Consumer electronics: Incorporated into smart home devices and IoT (Internet of Things) sensors for signal conditioning and interfacing, enabling seamless connectivity and efficient data processing.
  • Automotive electronics: Deployed in vehicle control modules for signal amplification and noise reduction, ensuring robust performance in automotive applications.
  • Medical devices: Integrated into diagnostic equipment and monitoring devices for precise signal processing, facilitating accurate measurements and reliable operation in medical settings.
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