74LVC1G175GM132

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Mfr.Part #
74LVC1G175GM132
Manufacturer
NXP Semiconductors
Package / Case
6-XFDFN
Datasheet
Download
Description
NOW NEXPERIA 74LVC1G175GM - D FL
Stock
51,010
In Stock :
51,010

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Manufacturer :
NXP Semiconductors
Product Category :
Specialized ICs
Number of Terminations :
6
Number of Bits :
1
Time@Peak Reflow Temperature-Max (s) :
40
Package / Case :
6-XFDFN
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Series :
74LVC
RoHS Status :
ROHS3 Compliant
Supply Voltage :
2.7V
Mount :
Surface Mount
Output Type :
Non-Inverted
Published :
2014
Type :
D-Type
Operating Temperature :
-40°C~125°C TA
Clock Edge Trigger Type :
POSITIVE EDGE
Trigger Type :
POSITIVE EDGE
Factory Lead Time :
13 Weeks
Family :
LVC/LCX/Z
Voltage - Supply :
1.65V~5.5V
Number of Circuits :
1
Terminal Position :
Dual
Polarity :
Non-Inverting
Logic Function :
D-Type, Flip-Flop
Base Part Number :
74LVC1G175
Clock Frequency :
200MHz
Function :
Reset
Max Propagation Delay @ V, Max CL :
4ns @ 5V, 50pF
Input Capacitance :
2.5pF
Mounting Type :
Surface Mount
Current - Quiescent (Iq) :
40μA
Contact Plating :
Tin
Quiescent Current :
100nA
Propagation Delay :
3.1 ns
JESD-609 Code :
e3
Packaging :
Tape and Reel (TR)
Supply Voltage-Max (Vsup) :
5.5V
Number of Pins :
6
Peak Reflow Temperature (Cel) :
260
Radiation Hardening :
No
Turn On Delay Time :
2.2 ns
Terminal Pitch :
0.5mm
fmax-Min :
200 MHz
Height Seated (Max) :
0.5mm
Current - Output High, Low :
32mA 32mA
Datasheets
74LVC1G175GM132
Introducing Specialized ICs NXP Semiconductors 74LVC1G175GM132 from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:6, Package / Case:6-XFDFN, Type:D-Type, Operating Temperature:-40°C~125°C TA, Base Part Number:74LVC1G175, Mounting Type:Surface Mount, Number of Pins:6, 74LVC1G175GM132 pinout, 74LVC1G175GM132 datasheet PDF, 74LVC1G175GM132 amp .Beyond Specialized ICs NXP Semiconductors 74LVC1G175GM132 ,we also offer AD8232ACPZ-R7, TDA21470AUMA1, DS2413P+, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors 74LVC1G175GM132


Specialized ICs NXP Semiconductors 74LVC1G175GM132 Overview

The NOW NEXPERIA 74LVC1G175GM D FL is a cutting-edge integrated circuit designed and manufactured by NXP Semiconductors, a renowned leader in the semiconductor industry. This specialized IC offers exceptional performance and reliability, making it an ideal choice for various applications in electronic devices and systems.

Featuring advanced technology and precision engineering, this IC delivers high-speed operation and low power consumption, ensuring efficient functionality in diverse environments. Its compact design and robust construction make it suitable for integration into a wide range of electronic products, from consumer electronics to industrial equipment.

Whether you're designing next-generation smartphones, automotive electronics, or industrial automation systems, the NXP Semiconductors 74LVC1G175GM132 provides the performance and versatility you need to stay ahead in today's competitive market.

74LVC1G175GM132 Features

  • High-speed operation
  • Low power consumption
  • Compact and robust design
  • Wide voltage range
  • Excellent reliability
  • Industry-leading performance

74LVC1G175GM132 Applications

  • Mobile Devices: The 74LVC1G175GM132 is perfect for use in smartphones and tablets, providing fast and reliable signal processing for enhanced user experiences.
  • Automotive Electronics: This IC is well-suited for automotive applications such as engine control units (ECUs) and infotainment systems, offering high-speed data processing and robust performance in harsh environments.
  • Industrial Automation: With its compact size and excellent reliability, the 74LVC1G175GM132 is an ideal choice for industrial automation equipment, including PLCs, motor control systems, and sensor interfaces.
  • IoT Devices: Enable the connectivity and intelligence of IoT devices with the 74LVC1G175GM132, providing efficient data processing and communication capabilities for smart home devices, wearables, and more.
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