74HCT7030N,112

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Mfr.Part #
74HCT7030N,112
Manufacturer
NXP Semiconductors
Package / Case
28-DIP (0.600, 15.24mm)
Datasheet
Download
Description
IC 9X64 FIFO REGISTER 3ST 28-DIP
Stock
4
In Stock :
4

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Manufacturer :
NXP Semiconductors
Product Category :
FIFOs Memory
Terminal Pitch :
2.54mm
Height Seated (Max) :
5.1mm
Number of Terminations :
28
Time@Peak Reflow Temperature-Max (s) :
30
Operating Temperature :
-40°C~125°C
Memory Density :
576 bit
Voltage - Supply :
4.5V~5.5V
Published :
1997
FWFT Support :
No
Package / Case :
28-DIP (0.600, 15.24mm)
HTS Code :
8542.39.00.01
JESD-30 Code :
R-PDIP-T28
Peak Reflow Temperature (Cel) :
260
Terminal Position :
Dual
Surface Mount :
No
Clock Frequency :
10MHz
Terminal Finish :
Matte Tin (Sn)
Output Characteristics :
3-STATE
Access Time :
40ns
Memory Size :
576 64 x 9
Additional Feature :
REGISTER BASED; BUBBLE BACK 3US
JESD-609 Code :
e3
Organization :
64X9
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Expansion Type :
Depth, Width
Packaging :
Tube
Parallel/Serial :
Parallel
Output Enable :
yes
Base Part Number :
74HCT7030
Supply Voltage-Max (Vsup) :
5.5V
Width :
15.24mm
Supply Voltage :
5V
Data Rate :
29MHz
Power Supplies :
5V
Memory Width :
9
Cycle Time :
116.28 ns
Memory IC Type :
OTHER FIFO
Supply Voltage-Min (Vsup) :
4.5V
Mounting Type :
Through Hole
Series :
74HCT
RoHS Status :
ROHS3 Compliant
Bus Directional :
Uni-Directional
Length :
35.5mm
Function :
Asynchronous, Synchronous
Datasheets
74HCT7030N,112
Introducing FIFOs Memory NXP Semiconductors 74HCT7030N,112 from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:28, Operating Temperature:-40°C~125°C, Package / Case:28-DIP (0.600, 15.24mm), Base Part Number:74HCT7030, Mounting Type:Through Hole, 74HCT7030N,112 pinout, 74HCT7030N,112 datasheet PDF, 74HCT7030N,112 amp .Beyond FIFOs Memory NXP Semiconductors 74HCT7030N,112 ,we also offer CY7C433-40JC, SN74ACT7201LA35RJ, SN74ACT7201LA35NP, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors 74HCT7030N,112


FIFOs Memory NXP Semiconductors 74HCT7030N,112 Overview

Introducing the NXP Semiconductors 74HCT7030N,112, a state-of-the-art integrated circuit (IC) specifically designed to handle high-speed data buffering needs with its FIFO (First-In, First-Out) register structure. This robust component is crafted for sophisticated applications requiring reliable and efficient data storage and transfer. The 74HCT7030N,112 is housed in a sturdy 28-pin DIP (Dual In-line Package) that safeguards the device's capabilities, making it an excellent choice for diverse electronic environments. Its 9X64 FIFO memory structure provides ample space for data queuing, ensuring smooth and uninterrupted data flow management. With NXP Semiconductors' commitment to quality, the 74HCT7030N,112 embodies durability and precision, promising an enhanced performance for systems requiring high-speed data processing and robust design. It is an indispensable tool for developers aiming to upgrade their systems with FIFOs Memory NXP Semiconductors 74HCT7030N,112 technology.

74HCT7030N,112 Features

  • 9X64 FIFO register for efficient data queuing
  • Three-state output for improved data flow control
  • 28DIP packaging suitable for a wide range of board layouts
  • High-speed data handling capabilities
  • Robust design by NXP Semiconductors, a trusted name in IC manufacturing

74HCT7030N,112 Applications

  • High-Speed Communication Systems: Enables precise data management for transmitting and receiving operations in data-intensive environments.
  • Network Routers and Switches: Utilized to manage data packets efficiently, ensuring seamless data flow across network infrastructure.
  • Signal Processing: Assists in the buffering of digital signal data, contributing to uninterrupted signal processing tasks.
  • Data Storage Systems: Serves as a reliable intermediary storage ensuring data integrity during high-volume storage operations.
  • Industrial Automation: Facilitates synchronized data exchange within automated manufacturing systems for enhanced process control.
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