74HCT40105D,112
- Mfr.Part #
- 74HCT40105D,112
- Manufacturer
- NXP Semiconductors
- Package / Case
- 16-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- IC 4X16 FIFO REGISTER 16-SOIC
- Stock
- 8,313
- In Stock :
- 8,313
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- Manufacturer :
- NXP Semiconductors
- Product Category :
- FIFOs Memory
- Memory Size :
- 64 16 x 4
- Terminal Pitch :
- 1.27mm
- Width :
- 3.9mm
- JESD-609 Code :
- e4
- Packaging :
- Tube
- Supply Voltage-Max (Vsup) :
- 5.5V
- Package / Case :
- 16-SOIC (0.154, 3.90mm Width)
- FWFT Support :
- No
- Operating Temperature :
- -40°C~125°C
- Bus Directional :
- Uni-Directional
- Published :
- 1998
- Output Enable :
- yes
- Expansion Type :
- Depth, Width
- Cycle Time :
- 100 ns
- HTS Code :
- 8542.39.00.01
- JESD-30 Code :
- R-PDSO-G16
- Memory Density :
- 64 Bit
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Parallel/Serial :
- Parallel
- Clock Frequency :
- 31MHz
- Function :
- ASYNCHRONOUS
- Terminal Position :
- Dual
- Terminal Finish :
- NICKEL PALLADIUM GOLD
- Memory IC Type :
- OTHER FIFO
- Length :
- 9.9mm
- Peak Reflow Temperature (Cel) :
- 260
- Organization :
- 16X4
- Mounting Type :
- Surface Mount
- Output Characteristics :
- 3-STATE
- Series :
- 74HCT
- Memory Width :
- 4
- Base Part Number :
- 74HCT40105
- Surface Mount :
- yes
- Access Time :
- 40ns
- Power Supplies :
- 5V
- Additional Feature :
- REGISTER BASED; BUBBLE BACK 750NS
- Voltage - Supply :
- 4.5V~5.5V
- Data Rate :
- 28MHz
- Terminal Form :
- Gull wing
- Time@Peak Reflow Temperature-Max (s) :
- 30
- RoHS Status :
- ROHS3 Compliant
- Supply Voltage :
- 5V
- Height Seated (Max) :
- 1.75mm
- Supply Voltage-Min (Vsup) :
- 4.5V
- Number of Terminations :
- 16
- Datasheets
- 74HCT40105D,112

The>The FIFO FIFOss Memory Memory N NXPXP Sem Semiconiconductductorsors 7474HHCTCT4014010505DD,,112112 is is a a high high-performance-performance integrated circuit specifically integrated circuit specifically designed designed to for address efficient the data needs buffering of in advanced various data digital buffering applications applications.. This This IC IC encompasses, a featuring a4 x416 x FIFO register16, FIFO making register it, ideal offers for robust situations reliability where and data superior must data be management stored capabilities temporarily in a before processing compact. Manufact16uredSO byIC N packageXP. Sem Manufacticonuredduct byors N,XP a Sem leadericon induct theors semiconductor, industry a leader in semiconductor, this component ensures innovation reliability, and this high product-speed ensures data efficient management and. smooth Its data compact flow between16 nonSO-sICynchronized package interfaces allows, for making seamless it an integration into a wide range essential component of for systems requiring electronic a devices precise and, supporting controlled robust data data streaming flow mechanism management. and Its minimizing ability system to latency handle.
This key integrated features circuit that stands enhance out due to its its applicability in sophisticated 4 digital x circuits 16:
FIFO
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