74AXP2T3407GT115

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Mfr.Part #
74AXP2T3407GT115
Manufacturer
NXP Semiconductors
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Description
NOW NEXPERIA 74AXP2T3407GT - BUF
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Manufacturer :
NXP Semiconductors
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Specialized ICs
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Datasheets
74AXP2T3407GT115
Introducing Specialized ICs NXP Semiconductors 74AXP2T3407GT115 from Chip IC,where excellence meets affordability. This product stands out with its 74AXP2T3407GT115 pinout, 74AXP2T3407GT115 datasheet PDF, 74AXP2T3407GT115 amp .Beyond Specialized ICs NXP Semiconductors 74AXP2T3407GT115 ,we also offer AD8232ACPZ-R7, TDA21470AUMA1, DS2413P+, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors 74AXP2T3407GT115


Specialized ICs NXP Semiconductors 74AXP2T3407GT115 Overview

The Specialized ICs NXP Semiconductors 74AXP2T3407GT115 is a cutting-edge dual-supply translating transceiver designed to address the needs of complex digital systems that require logic level translations between different operating voltage domains. This component ensures seamless communication in multi-voltage systems, supporting bidirectional voltage translation without direction pin control, which is ideal for applications where low power and high efficiency are critical. Its small footprint and compatibility with lower voltage systems make it especially suited for portable and space-constrained applications.


Key Features

The 74AXP2T3407GT115 boasts several key features that make it indispensable in modern electronics design:

  • Support for dual supply operation, enabling translation between 0.7 V and 2.75 V on the A port and 1.4 V to 5.5 V on the B port.
  • High-speed switching capability with a max propagation delay of only 4.1 ns, facilitating rapid data transfer.
  • Low quiescent current and lower power consumption which is crucial for battery-powered devices.
  • 8-pin XSON package for reduced space usage on PCBs.
  • High-impedance output when in power-off mode, minimizing power leakage.


Applications

The versatility of the 74AXP2T3407GT115 makes it suitable for a broad range of applications, including:

  • Mobile devices, where power efficiency and space are at a premium.
  • Data communication systems requiring high speed logic level translation.
  • Multi-voltage electronics that need reliable and flexible interfacing solutions.


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