72V3670L6PF8

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Mfr.Part #
72V3670L6PF8
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
TQFP
Datasheet
Download
Description
IC FIFO SS 8192X36 6NS 128-TQFP
Stock
34,935
In Stock :
34,935

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
FIFOs Memory
Height Seated (Max) :
1.6mm
JESD-609 Code :
e0
Operating Supply Voltage :
3.3V
Min Supply Voltage :
3.15V
Terminal Pitch :
0.5mm
Qualification Status :
Not Qualified
Word Size :
36b
Pbfree Code :
No
Supply Voltage :
3.3V
Terminal Finish :
Tin/Lead (Sn85Pb15)
Package / Case :
TQFP
Terminal Form :
Gull wing
Mount :
Surface Mount
Thickness :
1.4mm
Retransmit Capability :
yes
HTS Code :
8542.32.00.71
Length :
20mm
Contact Plating :
Lead, Tin
Frequency :
166MHz
Width :
14mm
Parallel/Serial :
Parallel
Temperature Grade :
COMMERCIAL
Number of Terminations :
128
Sync/Async :
SYNCHRONOUS
Nominal Supply Current :
40mA
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Output Enable :
yes
Pin Count :
128
Organization :
8KX36
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Cycle Time :
6 ns
Number of Functions :
1
Number of Pins :
128
Bus Directional :
Unidirectional
Frequency (Max) :
166MHz
RoHS Status :
RoHS Compliant
Standby Current-Max :
0.015A
Min Operating Temperature :
0°C
Terminal Position :
QUAD
Density :
288 kb
ECCN Code :
EAR99
Max Operating Temperature :
70°C
Max Supply Current :
40mA
Max Supply Voltage :
3.45V
Element Configuration :
Dual
Access Time :
4 ns
Lead Free :
Contains Lead
Published :
2008
Memory IC Type :
OTHER FIFO
Peak Reflow Temperature (Cel) :
225
Factory Lead Time :
7 Weeks
Datasheets
72V3670L6PF8
Introducing FIFOs Memory Intersil (Renesas Electronics Corporation) 72V3670L6PF8 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:TQFP, Number of Terminations:128, Number of Pins:128, 72V3670L6PF8 pinout, 72V3670L6PF8 datasheet PDF, 72V3670L6PF8 amp .Beyond FIFOs Memory Intersil (Renesas Electronics Corporation) 72V3670L6PF8 ,we also offer CY7C433-40JC, SN74ACT7201LA35RJ, SN74ACT7201LA35NP, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 72V3670L6PF8


FIFOs Memory Intersil (Renesas Electronics Corporation) 72V3670L6PF8 Overview

The FIFOs Memory Intersil (Renesas Electronics Corporation) 72V3670L6PF8 represents a cutting-edge solution in high-speed data buffering technology. Engineered for performance, this IC FIFO (First-In, First-Out memory) is designed to manage and speed up data flow between devices that operate at differing speeds or with different data processing capacities. With a storage capability of 8192x36 bits and an impressive speed of 6ns, this device caters to applications requiring high data throughput and minimal latency. Its 128TQFP packaging makes it suitable for compact systems that need high-volume data management without compromising on space or speed. The 72V3670L6PF8 is an ideal choice for developers looking to enhance system reliability and efficiency in sophisticated digital environments.

72V3670L6PF8 Features

This FIFO memory chip is tailored for systems that demand ultra-fast data buffering with large storage capabilities. Key features include:

  • High-Speed Operation: Quick access time of 6ns allows for rapid data transfer, reducing processing delays.
  • Large Storage Capacity: 8192x36 bits provide ample space for large volumes of data, ensuring smooth data handling.
  • Compact Form Factor: Housed in a 128TQFP package, it integrates seamlessly into a variety of industrial and commercial applications.
  • Robust Interface: Designed for easy integration with multiple systems, ensuring compatibility and reliability across platforms.

72V3670L6PF8 Applications

  • Telecommunications: Utilized in telecom infrastructures to manage data buffers between high-speed networks and processing units, improving throughput and reducing bottlenecks.
  • Video Broadcasting: Essential in the management of video data streams, ensuring seamless data flow for broadcast equipment.
  • Server Backplanes: Employed in server backplane designs to facilitate fast and reliable data transfer between server blades and storage arrays.
  • Medical Imaging: Critical in medical imaging systems, where it supports the high-speed transfer of large imaging data sets, contributing to faster processing and improved imaging quality.
  • Industrial Control Systems: Enhances the efficiency of industrial control systems by managing data exchange in automation and monitoring equipment.
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