72V3670L6PF
- Mfr.Part #
- 72V3670L6PF
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- TQFP
- Datasheet
- Download
- Description
- IC FIFO SS 8192X36 6NS 128-TQFP
- Stock
- 16,778
- In Stock :
- 16,778
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- FIFOs Memory
- RoHS Status :
- RoHS Compliant
- Pbfree Code :
- No
- Additional Feature :
- RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE
- Min Operating Temperature :
- 0°C
- Published :
- 2008
- Memory Density :
- 294912 bit
- Height Seated (Max) :
- 1.6mm
- Min Supply Voltage :
- 3.15V
- Number of Functions :
- 1
- Access Time :
- 4 ns
- Terminal Form :
- Gull wing
- Peak Reflow Temperature (Cel) :
- 225
- Bus Directional :
- Unidirectional
- Terminal Position :
- QUAD
- Operating Supply Voltage :
- 3.3V
- Supply Voltage :
- 3.3V
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Max Supply Voltage :
- 3.45V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- JESD-609 Code :
- e0
- Package / Case :
- TQFP
- Qualification Status :
- Not Qualified
- Temperature Grade :
- COMMERCIAL
- Mount :
- Surface Mount
- Width :
- 14mm
- Pin Count :
- 128
- Terminal Pitch :
- 0.5mm
- Cycle Time :
- 6 ns
- Number of Terminations :
- 128
- Length :
- 20mm
- Output Enable :
- yes
- HTS Code :
- 8542.32.00.71
- Frequency (Max) :
- 166MHz
- Max Supply Current :
- 40mA
- Organization :
- 8KX36
- Contact Plating :
- Lead, Tin
- Lead Free :
- Contains Lead
- Parallel/Serial :
- Parallel
- ECCN Code :
- EAR99
- Packaging :
- Bulk
- Retransmit Capability :
- yes
- Standby Current-Max :
- 0.015A
- Factory Lead Time :
- 7 Weeks
- Operating Mode :
- SYNCHRONOUS
- Number of Pins :
- 128
- Thickness :
- 1.4mm
- Terminal Finish :
- Tin/Lead (Sn85Pb15)
- Memory IC Type :
- OTHER FIFO
- Max Operating Temperature :
- 70°C
- Datasheets
- 72V3670L6PF

[FIFOs Memory Intersil (Renesas Electronics Corporation) 72V3670L6PF] Overview
Introducing the cutting-edge FIFOs Memory solution, the 72V3670L6PF, meticulously crafted by Intersil (Renesas Electronics Corporation). This innovative IC FIFO SS 8192X36 6NS 128TQFP offers unparalleled performance and reliability, making it the optimal choice for demanding industrial applications. With its lightning-fast 6ns speed and ample 8192x36 configuration, this FIFO memory enables seamless data transmission and storage, ensuring smooth operation even in high-stress environments. Whether you're streamlining data processing or enhancing system efficiency, the 72V3670L6PF sets the industry standard for excellence.
72V3670L6PF Features
- High-Speed Operation: Boasts an impressive 6ns access time for swift data retrieval and transmission.
- Large Capacity: With an ample 8192x36 configuration, it provides extensive memory space for storing critical data.
- Robust Construction: Designed to withstand rigorous industrial environments, ensuring long-lasting performance and reliability.
- Compact Form Factor: Housed in a space-saving 128TQFP package, it seamlessly integrates into various electronic systems with ease.
- Low Power Consumption: Optimized power management for efficient energy usage, ideal for battery-powered applications.
- Wide Temperature Range: Operates reliably across a broad temperature spectrum, from -40°C to 85°C, suitable for diverse industrial settings.
72V3670L6PF Applications
- Industrial Automation Systems: Enhances data processing speed and efficiency in automated manufacturing plants, ensuring seamless production line operations.
- Communications Infrastructure: Facilitates fast and reliable data transfer in telecommunications equipment, supporting uninterrupted network connectivity.
- Medical Devices: Enables high-speed data storage and retrieval in medical imaging systems, contributing to accurate diagnostic procedures and patient care.
- Test and Measurement Equipment: Provides ample memory capacity for storing measurement data in testing instruments, ensuring precise analysis and evaluation.
- Aerospace and Defense Systems: Supports critical data processing tasks in aerospace and defense applications, ensuring optimal performance in mission-critical scenarios.
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