72V283L10PF

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Mfr.Part #
72V283L10PF
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
TQFP
Datasheet
Download
Description
IC FIFO 32768X18 10NS 80QFP
Stock
19,536
In Stock :
19,536

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
FIFOs Memory
Min Supply Voltage :
3.15V
Mount :
Surface Mount
Width :
14mm
Height Seated (Max) :
1.6mm
Access Time :
6.5 ns
Published :
2003
JESD-609 Code :
e0
Density :
576 kb
Lead Free :
Contains Lead
Peak Reflow Temperature (Cel) :
240
Package / Case :
TQFP
Terminal Pitch :
0.65mm
Organization :
32KX18
Terminal Form :
Gull wing
Terminal Finish :
Tin/Lead (Sn85Pb15)
Temperature Grade :
COMMERCIAL
Max Supply Voltage :
3.45V
Retransmit Capability :
yes
Cycle Time :
10 ns
Factory Lead Time :
7 Weeks
Pin Count :
80
HTS Code :
8542.32.00.71
ECCN Code :
EAR99
Thickness :
1.4mm
Qualification Status :
Not Qualified
Length :
14mm
Bus Directional :
Unidirectional
Time@Peak Reflow Temperature-Max (s) :
20
Number of Terminations :
80
Frequency (Max) :
100MHz
Parallel/Serial :
Parallel
Terminal Position :
QUAD
Min Operating Temperature :
0°C
Number of Functions :
1
Supply Voltage :
3.3V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Max Supply Current :
35mA
Memory IC Type :
OTHER FIFO
Sync/Async :
SYNCHRONOUS
Pbfree Code :
No
Operating Supply Voltage :
3.3V
Max Operating Temperature :
70°C
Standby Current-Max :
0.015A
Element Configuration :
Dual
Number of Pins :
80
Frequency :
100MHz
RoHS Status :
RoHS Compliant
Output Enable :
yes
Contact Plating :
Lead, Tin
Datasheets
72V283L10PF
Introducing FIFOs Memory Intersil (Renesas Electronics Corporation) 72V283L10PF from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:TQFP, Number of Terminations:80, Number of Pins:80, 72V283L10PF pinout, 72V283L10PF datasheet PDF, 72V283L10PF amp .Beyond FIFOs Memory Intersil (Renesas Electronics Corporation) 72V283L10PF ,we also offer CY7C433-40JC, SN74ACT7201LA35RJ, SN74ACT7201LA35NP, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 72V283L10PF


[FIFOs Memory Intersil (Renesas Electronics Corporation) 72V283L10PF] Overview

This IC FIFO 32768X18 10NS 80QFP by Intersil (Renesas Electronics Corporation) is a high-performance integrated circuit designed to efficiently manage data flow in electronic systems. With a capacity of 32768 words of 18 bits each, and a fast access time of 10 nanoseconds, this FIFO memory chip is ideal for applications requiring rapid data processing and transfer.

Featuring a compact 80QFP package, this FIFO memory chip offers space-saving benefits while delivering reliable performance. Its robust design and high-speed operation make it suitable for a wide range of industrial and commercial applications.

72V283L10PF Features

  • High Capacity: Provides storage for up to 32768 words of 18 bits each.
  • Fast Access Time: Offers quick data retrieval with a latency of just 10 nanoseconds.
  • Compact Design: Housed in an 80QFP package for space-efficient integration into electronic systems.
  • Reliable Performance: Ensures consistent operation in demanding environments.
  • Versatile Compatibility: Compatible with various electronic devices and systems.

72V283L10PF Applications

  • Industrial Automation Systems: The 72V283L10PF FIFO memory chip is used in industrial automation systems for buffering and managing data streams between sensors, controllers, and actuators. Its fast access time and high capacity facilitate real-time data processing in manufacturing and assembly lines.
  • Telecommunication Equipment: In telecommunication equipment such as routers and switches, this FIFO memory chip helps in buffering data packets during transmission, ensuring smooth and uninterrupted communication. Its compact design makes it suitable for space-constrained networking devices.
  • Medical Imaging Devices: Medical imaging devices, including MRI machines and CT scanners, rely on the 72V283L10PF FIFO memory chip for storing and processing image data. Its high-speed operation and large storage capacity enable rapid image acquisition and reconstruction, contributing to improved diagnostic accuracy and efficiency.
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