72V275L20PF8

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Mfr.Part #
72V275L20PF8
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
TQFP
Datasheet
Download
Description
IC FIFO SS 32768X18 20NS 64-TQFP
Stock
45,661
In Stock :
45,661

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
FIFOs Memory
Factory Lead Time :
7 Weeks
HTS Code :
8542.32.00.71
Terminal Pitch :
0.8mm
Min Supply Voltage :
3V
Number of Pins :
64
Thickness :
1.4mm
Parallel/Serial :
Parallel
Peak Reflow Temperature (Cel) :
240
JESD-609 Code :
e0
Nominal Supply Current :
60mA
Max Supply Current :
60mA
Retransmit Capability :
yes
Operating Supply Voltage :
3.3V
RoHS Status :
RoHS Compliant
Bus Directional :
Unidirectional
Cycle Time :
20 ns
Temperature Grade :
COMMERCIAL
Frequency :
50MHz
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Pin Count :
64
Sync/Async :
SYNCHRONOUS
Min Operating Temperature :
0°C
Standby Current-Max :
0.015A
Mount :
Surface Mount
Element Configuration :
Dual
Number of Terminations :
64
Qualification Status :
Not Qualified
Word Size :
18b
Published :
2009
Height Seated (Max) :
1.6mm
Organization :
32KX18
Package / Case :
TQFP
Max Supply Voltage :
3.6V
Max Operating Temperature :
70°C
ECCN Code :
EAR99
Pbfree Code :
No
Length :
14mm
Terminal Position :
QUAD
Terminal Form :
Gull wing
Width :
14mm
Contact Plating :
Lead, Tin
Frequency (Max) :
50MHz
Density :
576 kb
Lead Free :
Contains Lead
Supply Voltage :
3.3V
Output Enable :
yes
Terminal Finish :
Tin/Lead (Sn85Pb15)
Time@Peak Reflow Temperature-Max (s) :
20
Access Time :
12 ns
Memory IC Type :
OTHER FIFO
Number of Functions :
1
Datasheets
72V275L20PF8
Introducing FIFOs Memory Intersil (Renesas Electronics Corporation) 72V275L20PF8 from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:64, Number of Terminations:64, Package / Case:TQFP, 72V275L20PF8 pinout, 72V275L20PF8 datasheet PDF, 72V275L20PF8 amp .Beyond FIFOs Memory Intersil (Renesas Electronics Corporation) 72V275L20PF8 ,we also offer CY7C433-40JC, SN74ACT7201LA35RJ, SN74ACT7201LA35NP, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 72V275L20PF8


[FIFOs Memory Intersil (Renesas Electronics Corporation) 72V275L20PF8] Overview

Introducing the cutting-edge FIFOs Memory solution, engineered by Intersil (Renesas Electronics Corporation) with precision and innovation. The 72V275L20PF8 IC FIFO SS 32768X18 20NS 64TQFP sets the benchmark for seamless data management and rapid information processing. Designed to exceed industry standards, this FIFOs Memory device ensures reliability, efficiency, and unparalleled performance.

With a focus on versatility and adaptability, this product caters to the diverse needs of B2B customers, empowering them with a competitive edge in today's dynamic market landscape. Explore the myriad possibilities and unleash the full potential of your applications with the FIFOs Memory solution from Intersil (Renesas Electronics Corporation).

72V275L20PF8 Features

  • High-Speed Operation: Delivers lightning-fast data processing with a remarkable speed of 20 nanoseconds.
  • Large Capacity: Boasts an impressive storage capacity of 32768X18, ensuring ample space for data storage and retrieval.
  • Robust Design: Built to withstand rigorous industrial environments, guaranteeing durability and longevity.
  • Compact Form Factor: Space-efficient 64-TQFP package facilitates easy integration into various electronic systems.
  • Low Power Consumption: Optimized power efficiency enhances operational performance while minimizing energy consumption.
  • Wide Compatibility: Compatible with a wide range of devices and applications, ensuring seamless integration and interoperability.

72V275L20PF8 Applications

  • Data Communication Systems: Utilized in networking equipment, routers, and switches for efficient data buffering and transmission.
  • Industrial Automation: Integrated into PLCs (Programmable Logic Controllers) and control systems to manage data flow in manufacturing processes.
  • Telecommunications Infrastructure: Deployed in base stations and communication systems for reliable data storage and retrieval in telecommunications networks.
  • Medical Devices: Incorporated into medical imaging equipment and diagnostic devices to handle large volumes of patient data with precision and accuracy.
  • Automotive Electronics: Embedded in automotive control units and infotainment systems to manage data streams and enhance vehicle performance.
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