72V255LA20TF
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- Mfr.Part #
- 72V255LA20TF
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- LQFP
- Datasheet
- Download
- Description
- IC FIFO SS 8192X18 20NS 64-STQFP
- Stock
- 41,630
- In Stock ：
- 41,630
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- FIFOs Memory
- Standby Current-Max :
- 0.015A
- Height Seated (Max) :
- 1.6mm
- Terminal Position :
- QUAD
- JESD-609 Code :
- e0
- Max Supply Voltage :
- 3.6V
- Density :
- 144 kb
- Peak Reflow Temperature (Cel) :
- 240
- Terminal Form :
- Gull wing
- Pin Count :
- 64
- Parallel/Serial :
- Parallel
- Radiation Hardening :
- No
- Contact Plating :
- Lead, Tin
- Lead Free :
- Contains Lead
- Nominal Supply Current :
- 55mA
- Max Operating Temperature :
- 70°C
- Thickness :
- 1.4mm
- Bus Directional :
- Unidirectional
- Time@Peak Reflow Temperature-Max (s) :
- 20
- ECCN Code :
- EAR99
- Sync/Async :
- SYNCHRONOUS
- Package / Case :
- LQFP
- Number of Pins :
- 64
- Frequency (Max) :
- 50MHz
- Organization :
- 8KX18
- Element Configuration :
- Dual
- RoHS Status :
- RoHS Compliant
- Factory Lead Time :
- 7 Weeks
- Operating Supply Voltage :
- 3.3V
- Additional Feature :
- RETRANSMIT
- Min Supply Voltage :
- 3V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Memory IC Type :
- OTHER FIFO
- Min Operating Temperature :
- 0°C
- Published :
- 2008
- Terminal Finish :
- Tin/Lead (Sn85Pb15)
- HTS Code :
- 8542.32.00.71
- Word Size :
- 18b
- Mount :
- Surface Mount
- Length :
- 10mm
- Retransmit Capability :
- yes
- Temperature Grade :
- COMMERCIAL
- Max Supply Current :
- 55mA
- Number of Terminations :
- 64
- Access Time :
- 12 ns
- Width :
- 10mm
- Data Bus Width :
- 18b
- Pbfree Code :
- No
- Cycle Time :
- 20 ns
- Terminal Pitch :
- 0.5mm
- Supply Voltage :
- 3.3V
- Number of Functions :
- 1
- Output Enable :
- yes
- Frequency :
- 50MHz
- Datasheets
- 72V255LA20TF
FIFOs Memory Intersil (Renesas Electronics Corporation) 72V255LA20TF Overview
Introducing the 72V255LA20TF from Intersil (Renesas Electronics Corporation), a high-performance FIFO (First-In, First-Out) memory IC, optimized for advanced data buffering applications. This FIFO memory component is designed to handle a substantial depth of 8192x18 bits, with a swift access time of 20 ns, encapsulated in a 64STQFP package. The 72V255LA20TF is engineered to support high-speed data communication and processing requirements, making it an essential element in sophisticated electronic systems where data integrity and speed are crucial. Its robust design ensures reliability and performance, making it a preferred choice for manufacturers aiming to enhance system efficiency and throughput.
72V255LA20TF Features
The 72V255LA20TF boasts several key features that make it highly advantageous for use in various high-speed computing and data processing environments. Key features include a large storage capacity of 8192x18 bits, ensuring ample space for data queuing and retrieval. The device's 20 ns access time facilitates rapid data handling, crucial for performance-critical applications. Moreover, its 64STQFP packaging is designed for compact yet robust integration into a variety of electronic assemblies.
72V255LA20TF Applications
- Telecommunications: In telecommunication systems, the 72V255LA20TF serves as a critical buffer component, managing data flow between processors and transmission mediums to prevent data loss during high-speed data transfer.
- Networking Equipment: Utilized in routers and switches, this FIFO memory helps in managing burst data from multiple sources, ensuring smooth and efficient network traffic handling.
- Video Processing: In video processing units, the 72V255LA20TF is essential for buffering video data streams, thus maintaining the integrity of video feeds and reducing latency.
- Industrial Control Systems: For industrial applications, it provides reliable data queuing for sensor readings and control signals, ensuring timely and sequential processing.
- Medical Equipment: This FIFO memory is used in medical imaging devices, where it buffers large volumes of imaging data, helping in the rapid processing and analysis required for medical diagnostics.
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