72V2105L10PF8

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Mfr.Part #
72V2105L10PF8
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
TQFP
Datasheet
Download
Description
IC FIFO SUPERSYNCII 10NS 64-TQFP
Stock
36,686
In Stock :
36,686

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
FIFOs Memory
Access Time :
6.5 ns
RoHS Status :
RoHS Compliant
Density :
4.5 Mb
Frequency (Max) :
100MHz
Min Supply Voltage :
3V
Sync/Async :
SYNCHRONOUS
Mount :
Surface Mount
Qualification Status :
Not Qualified
Organization :
256KX18
Nominal Supply Current :
60mA
Cycle Time :
10 ns
Parallel/Serial :
Parallel
Max Operating Temperature :
70°C
Additional Feature :
EASILY EXPANDABLE IN DEPTH AND WIDTH
Factory Lead Time :
7 Weeks
HTS Code :
8542.32.00.71
Width :
14mm
Terminal Form :
Gull wing
Min Operating Temperature :
0°C
Number of Functions :
1
Peak Reflow Temperature (Cel) :
240
Terminal Position :
QUAD
ECCN Code :
EAR99
Package / Case :
TQFP
Max Supply Current :
60mA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Frequency :
100MHz
Pin Count :
64
Terminal Finish :
Tin/Lead (Sn85Pb15)
Terminal Pitch :
0.8mm
Number of Pins :
64
Time@Peak Reflow Temperature-Max (s) :
20
Height Seated (Max) :
1.6mm
Operating Supply Voltage :
3.3V
Bus Directional :
Unidirectional
Retransmit Capability :
yes
Word Size :
18b
Max Supply Voltage :
3.6V
Pbfree Code :
No
Published :
2008
Temperature Grade :
COMMERCIAL
Lead Free :
Contains Lead
Thickness :
1.4mm
Memory IC Type :
OTHER FIFO
Supply Voltage :
3.3V
Element Configuration :
Dual
Output Enable :
yes
Standby Current-Max :
0.02A
Length :
14mm
JESD-609 Code :
e0
Contact Plating :
Lead, Tin
Number of Terminations :
64
Datasheets
72V2105L10PF8
Introducing FIFOs Memory Intersil (Renesas Electronics Corporation) 72V2105L10PF8 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:TQFP, Number of Pins:64, Number of Terminations:64, 72V2105L10PF8 pinout, 72V2105L10PF8 datasheet PDF, 72V2105L10PF8 amp .Beyond FIFOs Memory Intersil (Renesas Electronics Corporation) 72V2105L10PF8 ,we also offer CY7C433-40JC, SN74ACT7201LA35RJ, SN74ACT7201LA35NP, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 72V2105L10PF8


FIFOs Memory Intersil (Renesas Electronics Corporation) 72V2105L10PF8 Overview

The FIFOs Memory Intersil (Renesas Electronics Corporation) 72V2105L10PF8 is a highly advanced, SuperSync II FIFO (First-In, First-Out) memory IC, designed to meet the demanding requirements of high-speed data communication systems. With a quick access time of just 10 ns and packaged in a compact 64TQFP, this IC is ideal for applications requiring fast and reliable data buffering and storage. Its integration into systems helps streamline data flow, enhance throughput, and reduce latency, making it an excellent choice for developers looking to improve the performance of their digital systems.

72V2105L10PF8 Features

The 72V2105L10PF8 IC boasts a range of features that make it a standout choice for high-speed data handling. These include its rapid 10 ns access time, a robust 64TQFP packaging that ensures reliability and durability, and its capability to efficiently manage data traffic in multi-processor environments. The device's architecture is also optimized for synchronous operation, further enhancing its performance in complex digital systems.

72V2105L10PF8 Applications

  • Telecommunications: Utilized in switching and signal processing to manage high-speed data transfers effectively.
  • Networking Equipment: Employs in routers and switches for buffering data packets, ensuring smooth data flow and reduced packet loss.
  • Video Broadcasting: Critical in live video streaming technology, where consistent data throughput is necessary to prevent delays and buffering.
  • Industrial Control Systems: Helps in managing data input and output in real-time control systems, enhancing process efficiency and reliability.
  • Medical Imaging Equipment: Used in devices such as MRI and CT scanners to handle rapid data acquisition and processing, ensuring high-resolution imaging.
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