72T3685L5BBI

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Mfr.Part #
72T3685L5BBI
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
BGA
Datasheet
Download
Description
IC FIFO 16384X36 5NS 208-BGA
Stock
6,298
In Stock :
6,298

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
FIFOs Memory
Min Operating Temperature :
-40°C
Sync/Async :
ASYNCHRONOUS
Cycle Time :
5 ns
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Package / Case :
BGA
FWFT Support :
yes
JESD-609 Code :
e0
Length :
17mm
Published :
2009
Peak Reflow Temperature (Cel) :
225
Function :
Asynchronous, Synchronous
Memory IC Type :
OTHER FIFO
Number of Terminations :
208
Standby Current-Max :
0.01A
Data Rate :
83MHz, 200MHz
Max Operating Temperature :
85°C
Temperature Grade :
Industrial
Word Size :
36b
Supply Voltage :
2.5V
Operating Temperature :
-40°C ~ 85°C
Output Enable :
yes
Element Configuration :
Dual
Height Seated (Max) :
1.97mm
Retransmit Capability :
yes
Organization :
16KX36
Base Part Number :
72T3685
Parallel/Serial :
Parallel
Max Supply Voltage :
2.625V
Number of Pins :
208
Min Supply Voltage :
2.375V
Access Time :
3.6 ns
Terminal Finish :
Tin/Lead (Sn63Pb37)
Terminal Form :
Ball
HTS Code :
8542.32.00.71
Terminal Pitch :
1mm
Mount :
Surface Mount
Packaging :
Tray
Voltage - Supply :
2.375V ~ 2.625V
Max Supply Current :
70mA
Pbfree Code :
No
Thickness :
1.76mm
Series :
72T
Time@Peak Reflow Temperature-Max (s) :
20
Lead Free :
Contains Lead
Density :
576 kb
RoHS Status :
RoHS Compliant
Memory Size :
576K (16K x 36)
Expansion Type :
Depth, Width
Frequency (Max) :
200MHz
Bus Directional :
Unidirectional
ECCN Code :
EAR99
Supplier Device Package :
208-PBGA (17x17)
Nominal Supply Current :
70mA
Terminal Position :
BOTTOM
Width :
17mm
Current - Supply (Max) :
70mA
Mounting Type :
Surface Mount
Number of Functions :
1
Qualification Status :
Not Qualified
Contact Plating :
Lead, Tin
Programmable Flags Support :
yes
Operating Supply Voltage :
2.5V
Pin Count :
208
Datasheets
72T3685L5BBI
Introducing FIFOs Memory Intersil (Renesas Electronics Corporation) 72T3685L5BBI from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:BGA, Number of Terminations:208, Operating Temperature:-40°C ~ 85°C, Base Part Number:72T3685, Number of Pins:208, Mounting Type:Surface Mount, 72T3685L5BBI pinout, 72T3685L5BBI datasheet PDF, 72T3685L5BBI amp .Beyond FIFOs Memory Intersil (Renesas Electronics Corporation) 72T3685L5BBI ,we also offer CY7C433-40JC, SN74ACT7201LA35RJ, SN74ACT7201LA35NP, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 72T3685L5BBI


FIFOs Memory Intersil (Renesas Electronics Corporation) 72T3685L5BBI Overview

The FIFOs Memory Intersil (Renesas Electronics Corporation) 72T3685L5BBI is a high-performance integrated circuit designed for demanding applications requiring robust data buffering and storage. This IC provides a large 16384x36 storage matrix, operating at an ultra-fast 5 ns speed, housed in a compact 208 BGA package. It offers reliable performance in data throughput and is engineered to support advanced data management and signal integrity. Ideal for systems requiring high-speed data acquisition and real-time processing, the 72T3685L5BBI stands out as a critical component for enhancing system reliability and efficiency in complex digital environments.

72T3685L5BBI Features

The 72T3685L5BBI FIFO memory boasts several key features that make it an exceptional choice for high-speed data applications:

  • Large data capacity of 16384x36, allowing extensive data storage and retrieval.
  • High-speed performance with a minimal access time of 5 nanoseconds.
  • Compact 208-Ball Grid Array (BGA) package, ensuring a minimal footprint on system boards.
  • Designed for easy integration into various digital systems with its standardized interface.

72T3685L5BBI Applications

  • Telecommunications Infrastructure: Utilized in network routers and switches to manage data packets efficiently, ensuring seamless data flow and reduced latency in communication systems.
  • Video Broadcasting: Essential in video processing equipment for buffering video streams, enhancing the quality and reliability of broadcast signals.
  • High-Speed Computing: Deployed in servers and high-performance computers for fast data caching, improving system responsiveness and processing capabilities.
  • Industrial Control Systems: Helps in managing real-time data in industrial environments, ensuring timely and accurate control and automation of processes.
  • Medical Imaging Systems: Critical in handling large volumes of imaging data swiftly, aiding in faster diagnostics and better patient care outcomes.
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