7281L15PAI
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- Mfr.Part #
- 7281L15PAI
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- TSSOP
- Datasheet
- Download
- Description
- IC MEM FIFO 512X9 15NS 56-TSSOP
- Stock
- 27,911
- In Stock ：
- 27,911
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- FIFOs Memory
- Temperature Grade :
- Industrial
- Number of Pins :
- 56
- JESD-609 Code :
- e0
- Packaging :
- Tube
- Radiation Hardening :
- No
- Frequency (Max) :
- 40MHz
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Contact Plating :
- Lead, Tin
- Pbfree Code :
- No
- Package / Case :
- TSSOP
- Pin Count :
- 56
- Number of Functions :
- 2
- Power Supplies :
- 5V
- Factory Lead Time :
- 7 Weeks
- Output Enable :
- No
- FWFT Support :
- No
- Parallel/Serial :
- Parallel
- Additional Feature :
- RETRANSMIT
- Memory Size :
- 512B
- Terminal Pitch :
- 0.5mm
- Standby Current-Max :
- 0.015A
- Operating Supply Voltage :
- 5V
- Current - Supply (Max) :
- 125mA
- Programmable Flags Support :
- No
- Number of Terminations :
- 56
- RoHS Status :
- RoHS Compliant
- Width :
- 6.1mm
- Retransmit Capability :
- yes
- Data Rate :
- 40MHz
- Density :
- 9 kb
- Operating Temperature :
- -40°C ~ 85°C
- Mounting Type :
- Surface Mount
- Function :
- ASYNCHRONOUS
- Mount :
- Surface Mount
- Time@Peak Reflow Temperature-Max (s) :
- 20
- Number of Circuits :
- 2
- Series :
- 7200
- Access Time :
- 15 ns
- Expansion Type :
- Depth, Width
- Length :
- 14mm
- Min Supply Voltage :
- 4.5V
- Word Size :
- 9b
- Bus Directional :
- Unidirectional
- Max Supply Current :
- 125mA
- Element Configuration :
- Dual
- Memory IC Type :
- OTHER FIFO
- Max Operating Temperature :
- 85°C
- Terminal Form :
- Gull wing
- Thickness :
- 1mm
- Sync/Async :
- ASYNCHRONOUS
- Published :
- 2005
- Peak Reflow Temperature (Cel) :
- 240
- Voltage - Supply :
- 4.5V ~ 5.5V
- Nominal Supply Current :
- 125mA
- Terminal Finish :
- Tin/Lead (Sn85Pb15)
- Data Bus Width :
- 9b
- Min Operating Temperature :
- -40°C
- Base Part Number :
- 7281
- Supply Voltage :
- 5V
- Max Supply Voltage :
- 5.5V
- Supplier Device Package :
- 56-TSSOP
- ECCN Code :
- EAR99
- Lead Free :
- Contains Lead
- Datasheets
- 7281L15PAI
FIFOs Memory Intersil (Renesas Electronics Corporation) 7281L15PAI Overview
The FIFOs Memory Intersil (Renesas Electronics Corporation) 7281L15PAI is a high-performance integrated circuit specifically designed for advanced FIFO (First In, First Out) memory applications. This IC ensures swift data buffering with a speed of 15 ns and is housed in a compact 56TSSOP package. The 7281L15PAI is capable of handling data widths up to 9 bits, with a depth of 512 locations, making it ideal for high-speed data transfer and storage solutions where space and speed are critical. Its reliability and efficiency make it highly suitable for sophisticated electronics that require robust and fast memory management systems.
7281L15PAI Features
The 7281L15PAI FIFO memory IC offers several key features that enhance its applicability in high-speed data processing environments. These include a quick access time of 15 nanoseconds, a manageable data width of 9 bits, and a total storage capacity of 512 x 9 bits. The 56TSSOP package ensures a minimal footprint on the PCB, facilitating easier integration into existing designs without compromising on performance. This IC also boasts low power consumption and high data integrity, essential for critical system operations.
7281L15PAI Applications
- Telecommunications: Used in routers and switches for packet buffering, ensuring efficient data flow and reducing latency in network communications.
- Video Processing: Applied in video capture systems where large amounts of data need to be written and read quickly to avoid frame drops and maintain video integrity.
- Industrial Control: Utilized in industrial automation systems for data logging and real-time process control, where rapid access to data sequences is critical for system responsiveness and accuracy.
- Medical Imaging: Integrated into medical imaging systems such as MRI and CT scanners to manage the high-speed data throughput required for real-time imaging processing.
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