72251L10PF8
- Mfr.Part #
- 72251L10PF8
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- TQFP
- Datasheet
- Download
- Description
- IC FIFO SYNC 512X9 10NS 32QFP
- Stock
- 46,333
- In Stock :
- 46,333
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- * Fullname:
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- FIFOs Memory
- Lead Free :
- Contains Lead
- Max Operating Temperature :
- 70°C
- Contact Plating :
- Lead, Tin
- Length :
- 7mm
- Terminal Finish :
- Tin/Lead (Sn85Pb15)
- Terminal Form :
- Gull wing
- FWFT Support :
- No
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- RoHS Status :
- RoHS Compliant
- Density :
- 72 kb
- Package / Case :
- TQFP
- Access Time :
- 6.5 ns
- Sync/Async :
- SYNCHRONOUS
- Word Size :
- 9b
- Factory Lead Time :
- 7 Weeks
- Pin Count :
- 32
- Element Configuration :
- Dual
- ECCN Code :
- EAR99
- Min Supply Voltage :
- 4.5V
- Output Enable :
- yes
- Max Supply Current :
- 50mA
- Pbfree Code :
- No
- Memory IC Type :
- OTHER FIFO
- Power Supplies :
- 5V
- Min Operating Temperature :
- 0°C
- Max Supply Voltage :
- 5.5V
- Published :
- 2008
- Temperature Grade :
- COMMERCIAL
- Terminal Position :
- QUAD
- Height Seated (Max) :
- 1.6mm
- JESD-609 Code :
- e0
- Peak Reflow Temperature (Cel) :
- 240
- Number of Pins :
- 32
- Terminal Pitch :
- 0.8mm
- Width :
- 7mm
- Number of Terminations :
- 32
- Organization :
- 8KX9
- Frequency (Max) :
- 100MHz
- Parallel/Serial :
- Parallel
- Programmable Flags Support :
- yes
- Operating Supply Voltage :
- 5V
- Nominal Supply Current :
- 50mA
- Mount :
- Surface Mount
- Bus Directional :
- Unidirectional
- Standby Current-Max :
- 0.005A
- Frequency :
- 100MHz
- Thickness :
- 1.4mm
- Supply Voltage :
- 5V
- Number of Functions :
- 1
- Cycle Time :
- 10 ns
- Datasheets
- 72251L10PF8

FIFOs Memory Intersil (Renesas Electronics Corporation) 72251L10PF8 Overview
Introducing the cutting-edge FIFOs Memory solution, meticulously crafted by Intersil (Renesas Electronics Corporation), the 72251L10PF8 is a pinnacle of innovation in integrated circuits. Designed to optimize data synchronization and storage, this IC FIFO SYNC 512X9 10NS 32QFP offers unparalleled performance and reliability.
With a focus on precision and efficiency, this Intersil creation empowers businesses with seamless data management capabilities, ensuring smooth operations even in the most demanding environments. Whether it's data buffering, synchronization, or queuing tasks, the 72251L10PF8 stands as a beacon of excellence, driving productivity and enhancing workflow efficiency.
Embrace the future of data handling with the FIFOs Memory Intersil (Renesas Electronics Corporation) 72251L10PF8, your trusted companion in the realm of integrated circuits.
72251L10PF8 Features
- High-speed data synchronization: Achieve lightning-fast data synchronization with a clock speed of 10 nanoseconds.
- Ample storage capacity: Benefit from the extensive storage capacity of 512x9, ensuring seamless data handling.
- Compact form factor: The 32QFP package offers a compact design, ideal for space-constrained applications.
- Robust reliability: Built to withstand rigorous industrial environments, ensuring long-term performance and durability.
- Efficient data management: Streamline data buffering and queuing tasks for enhanced workflow efficiency.
72251L10PF8 Applications
- Data communication systems: Implement the 72251L10PF8 in data communication systems to manage and synchronize incoming and outgoing data streams effectively. Its high-speed synchronization capabilities make it ideal for ensuring data integrity and reliability.
- Industrial automation: Enhance industrial automation processes by integrating the 72251L10PF8 for efficient data buffering and queuing. Its compact form factor and robust reliability make it suitable for demanding industrial environments.
- Telecommunication infrastructure: Optimize telecommunication infrastructure with the 72251L10PF8, ensuring seamless data handling and synchronization. Its high-speed performance and ample storage capacity make it a valuable asset in telecommunications applications.
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