72225LB10PF8
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- Mfr.Part #
- 72225LB10PF8
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- TQFP
- Datasheet
- Download
- Description
- IC FIFO 1024X18 SYNC 10NS 64TQFP
- Stock
- 33,436
- In Stock ：
- 33,436
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- FIFOs Memory
- Published :
- 2009
- Terminal Form :
- Gull wing
- Current - Supply (Max) :
- 60mA
- FWFT Support :
- No
- Packaging :
- Tape and Reel (TR)
- Bus Directional :
- Unidirectional
- Series :
- 7200
- Nominal Supply Current :
- 60mA
- JESD-609 Code :
- e0
- Frequency (Max) :
- 100MHz
- Terminal Pitch :
- 0.8mm
- Contact Plating :
- Lead, Tin
- Memory IC Type :
- OTHER FIFO
- Voltage - Supply :
- 4.5V ~ 5.5V
- Thickness :
- 1.4mm
- Access Time :
- 6.5 ns
- Parallel/Serial :
- Parallel
- Programmable Flags Support :
- yes
- Pin Count :
- 64
- Function :
- SYNCHRONOUS
- Base Part Number :
- 72225
- Terminal Position :
- QUAD
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Height Seated (Max) :
- 1.6mm
- Organization :
- 1KX18
- Peak Reflow Temperature (Cel) :
- 240
- Number of Pins :
- 64
- Supply Voltage :
- 5V
- Density :
- 18 kb
- Max Supply Current :
- 60mA
- Number of Functions :
- 1
- Retransmit Capability :
- No
- Width :
- 14mm
- RoHS Status :
- RoHS Compliant
- Output Enable :
- yes
- Expansion Type :
- Depth, Width
- Operating Temperature :
- 0°C ~ 70°C
- Power Supplies :
- 5V
- Mount :
- Surface Mount
- Cycle Time :
- 10 ns
- Word Size :
- 18b
- Memory Size :
- 18K (1K x 18)
- Min Operating Temperature :
- 0°C
- HTS Code :
- 8542.32.00.71
- Factory Lead Time :
- 7 Weeks
- Time@Peak Reflow Temperature-Max (s) :
- 20
- Standby Current-Max :
- 0.005A
- Data Rate :
- 100MHz
- Operating Supply Voltage :
- 5V
- Pbfree Code :
- No
- Max Operating Temperature :
- 70°C
- Lead Free :
- Contains Lead
- Min Supply Voltage :
- 4.5V
- Number of Terminations :
- 64
- Package / Case :
- TQFP
- Terminal Finish :
- Tin/Lead (Sn85Pb15)
- Max Supply Voltage :
- 5.5V
- Frequency :
- 100MHz
- ECCN Code :
- EAR99
- Temperature Grade :
- COMMERCIAL
- Element Configuration :
- Dual
- Sync/Async :
- SYNCHRONOUS
- Mounting Type :
- Surface Mount
- Length :
- 14mm
- Supplier Device Package :
- 64-TQFP (14x14)
- Datasheets
- 72225LB10PF8
FIFOs Memory Intersil (Renesas Electronics Corporation) 72225LB10PF8 Overview
The Intersil (Renesas Electronics Corporation) 72225LB10PF8 is a high-performance FIFO (First In, First Out) memory IC designed for advanced data buffering applications. This component excels in environments requiring rapid data storage and retrieval without the penalties of high-latency memory access. The 72225LB10PF8 operates at a speed of 10ns with a 1024x18 memory array, encapsulated in a compact 64TQFP package, making it an ideal solution for streamlining operations in high-speed computing and communications systems. With its robust build and precision engineering, the FIFOs Memory Intersil (Renesas Electronics Corporation) 72225LB10PF8 ensures reliable and efficient data handling, fostering enhanced system performance and scalability.
72225LB10PF8 Features
The 72225LB10PF8 FIFO memory IC by Intersil offers several key features that make it an outstanding choice for high-speed data transfer applications. These features include a quick access time of 10 nanoseconds, a synchronous operation mode, and a deep buffer capacity of 1024 words by 18 bits. Its 64TQFP package ensures a minimal footprint on the circuit board while providing optimal functionality and heat dissipation.
72225LB10PF8 Applications
- Telecommunications Equipment: Utilized in routers and switches for packet buffering, ensuring smooth data flow and reduced packet loss.
- Video Broadcasting: Ideal for video processing equipment, where consistent data throughput is necessary to maintain uninterrupted streaming and broadcasting quality.
- High-Speed Data Acquisition Systems: Applied in scientific and industrial environments to manage data collection with precision and minimal time delay.
- Server Backplanes: Helps in managing data flow between server components, enhancing overall system efficiency and reliability in data centers.
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