72221L10PF8

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Mfr.Part #
72221L10PF8
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
TQFP
Datasheet
Download
Description
IC FIFO SYNC 1KX9 10NS 32QFP
Stock
12,123
In Stock :
12,123

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
FIFOs Memory
Supply Voltage :
5V
Frequency (Max) :
100MHz
Terminal Finish :
Tin/Lead (Sn85Pb15)
Height Seated (Max) :
1.6mm
Temperature Grade :
COMMERCIAL
Min Operating Temperature :
0°C
Power Supplies :
5V
Max Supply Voltage :
5.5V
Frequency :
100MHz
Memory IC Type :
OTHER FIFO
Nominal Supply Current :
35mA
Max Supply Current :
35mA
Number of Pins :
32
FWFT Support :
No
Published :
1999
Bus Directional :
Unidirectional
Terminal Position :
QUAD
Length :
7mm
Element Configuration :
Dual
Cycle Time :
10 ns
Package / Case :
TQFP
RoHS Status :
RoHS Compliant
Contact Plating :
Lead, Tin
Output Enable :
yes
Mount :
Surface Mount
Word Size :
9b
Min Supply Voltage :
4.5V
Terminal Pitch :
0.8mm
Organization :
1KX9
Terminal Form :
Gull wing
Peak Reflow Temperature (Cel) :
240
Width :
7mm
Density :
9 kb
Number of Terminations :
32
Programmable Flags Support :
yes
Lead Free :
Contains Lead
Number of Functions :
1
Sync/Async :
SYNCHRONOUS
Pbfree Code :
No
Parallel/Serial :
Parallel
ECCN Code :
EAR99
JESD-609 Code :
e0
Max Operating Temperature :
70°C
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Operating Supply Voltage :
5V
Thickness :
1.4mm
Pin Count :
32
Access Time :
6.5 ns
Standby Current-Max :
0.005A
Factory Lead Time :
7 Weeks
Datasheets
72221L10PF8
Introducing FIFOs Memory Intersil (Renesas Electronics Corporation) 72221L10PF8 from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:32, Package / Case:TQFP, Number of Terminations:32, 72221L10PF8 pinout, 72221L10PF8 datasheet PDF, 72221L10PF8 amp .Beyond FIFOs Memory Intersil (Renesas Electronics Corporation) 72221L10PF8 ,we also offer CY7C433-40JC, SN74ACT7201LA35RJ, SN74ACT7201LA35NP, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 72221L10PF8


FIFOs Memory Intersil (Renesas Electronics Corporation) 72221L10PF8 Overview

The Intersil (Renesas Electronics Corporation) 72221L10PF8 IC represents a pivotal advancement in the field of synchronized FIFO (First-In, First-Out) memory solutions. Designed to cater to high-speed data buffering requirements, this device ensures robust performance with its 1K x 9 bit configuration and a swift 10 ns operational speed. Encapsulated in a compact 32-QFP (Quad Flat Package), the 72221L10PF8 combines space efficiency with high reliability, making it an ideal choice for sophisticated digital systems that demand rapid data flow and minimal latency. This product's key feature, the FIFOs Memory Intersil (Renesas Electronics Corporation) 72221L10PF8, not only emphasizes its manufacturer's commitment to quality but also enhances its appeal to B2B customers looking for efficient, scalable solutions.

72221L10PF8 Features

  • 1K x 9 memory configuration: Provides ample space for temporary data storage in buffering applications.
  • 10 ns access time: Enables extremely fast data throughput, reducing delay in critical processing tasks.
  • 32-QFP packaging: Offers a reliable and space-efficient footprint for integrated system designs.
  • Synchronous operation: Ensures precise timing and coordination with system clock signals for efficient data handling.

72221L10PF8 Applications

  • High-Speed Networking Equipment: Utilized in routers and switches for packet buffering, allowing for efficient data flow management and minimizing packet loss.
  • Data Communication Systems: Serves as a critical component in telecom infrastructure by facilitating rapid data exchange and buffering, ensuring uninterrupted service.
  • Video Processing: Used in video editing and broadcasting equipment to manage high-resolution video data streams effectively.
  • Industrial Control Systems: Enhances reliability and performance in automation and process control by handling fast data logging and sensor data aggregation.
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