70V9269L12PRF8

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Mfr.Part #
70V9269L12PRF8
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
TQFP
Datasheet
Download
Description
IC SRAM 256KBIT PARALLEL 128TQFP
Stock
44,988
In Stock :
44,988

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Density :
256 kb
I/O Type :
COMMON
Base Part Number :
IDT70V9269
Width :
14mm
Interface :
Parallel
Pbfree Code :
No
Temperature Grade :
COMMERCIAL
Supply Voltage :
3.3V
Peak Reflow Temperature (Cel) :
225
Write Cycle Time - Word, Page :
--
Height Seated (Max) :
1.6mm
Nominal Supply Current :
205mA
Memory Interface :
Parallel
Mount :
Surface Mount
Memory Type :
RAM, SDR, SRAM
Number of Terminations :
128
Length :
20mm
Frequency :
33.3MHz
Voltage - Supply :
3 V ~ 3.6 V
Published :
2008
Max Supply Voltage :
3.6V
Series :
--
Memory Size :
32kB
Factory Lead Time :
7 Weeks
JESD-609 Code :
e0
Standby Voltage-Min :
3V
Min Supply Voltage :
3V
Terminal Position :
QUAD
Organization :
16KX16
Terminal Finish :
Tin/Lead (Sn85Pb15)
Terminal Pitch :
0.5mm
Packaging :
Tape and Reel (TR)
Sync/Async :
SYNCHRONOUS
Operating Temperature :
0°C ~ 70°C (TA)
Pin Count :
128
Memory Format :
SRAM
Standby Current-Max :
0.003A
Thickness :
1.4mm
ECCN Code :
EAR99
Min Operating Temperature :
0°C
Number of Pins :
128
Lead Free :
Contains Lead
Address Bus Width :
28b
Mounting Type :
Surface Mount
Number of Ports :
2
Operating Supply Voltage :
3.3V
RoHS Status :
RoHS Compliant
Additional Feature :
FLOW-THROUGH OR PIPELINED ARCHITECTURE
Output Characteristics :
3-STATE
Word Size :
16b
Terminal Form :
Gull wing
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Package / Case :
TQFP
Radiation Hardening :
No
Number of Functions :
1
Max Operating Temperature :
70°C
Access Time :
12 ns
Supplier Device Package :
128-TQFP (14x20)
Datasheets
70V9269L12PRF8
Introducing Memory Intersil (Renesas Electronics Corporation) 70V9269L12PRF8 from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:IDT70V9269, Number of Terminations:128, Operating Temperature:0°C ~ 70°C (TA), Number of Pins:128, Mounting Type:Surface Mount, Package / Case:TQFP, 70V9269L12PRF8 pinout, 70V9269L12PRF8 datasheet PDF, 70V9269L12PRF8 amp .Beyond Memory Intersil (Renesas Electronics Corporation) 70V9269L12PRF8 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 70V9269L12PRF8


Memory Intersil (Renesas Electronics Corporation) 70V9269L12PRF8 Overview

The Memory Intersil (Renesas Electronics Corporation) 70V9269L12PRF8 is a high-performance IC SRAM with a storage capacity of 256Kbit, designed to meet the rigorous demands of sophisticated electronic systems. Packaged in a compact 128TQFP format, this SRAM device offers fast access times and low power consumption, making it an ideal choice for applications requiring high-speed data retrieval and storage. The robust design and reliability of the 70V9269L12PRF8 make it perfectly suited for a range of industrial and commercial applications, ensuring efficient and continuous operation in critical environments.

70V9269L12PRF8 Features

This SRAM features a parallel interface, facilitating quick and easy integration into existing technology frameworks without the need for extensive redevelopment. The 128TQFP package ensures a minimal footprint on the system board, which is critical for applications with space constraints. Moreover, its low power consumption helps in maintaining the efficiency of the overall system, thereby reducing operational costs and extending the life of the product.

70V9269L12PRF8 Applications

  • Embedded Systems: Utilized in complex real-time systems where quick data access is crucial.
  • Telecommunications: Supports high-speed telecommunications equipment by providing rapid access to data buffers.
  • Industrial Automation: Critical for control systems requiring fast and reliable data storage and retrieval to manage operations smoothly.
  • Aerospace and Defense: Used in applications demanding rugged and robust memory solutions capable of withstanding extreme environmental conditions.
  • Medical Devices: Integral in advanced medical diagnostic equipment, ensuring quick data processing and reliability for critical patient care.
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