70V9159L7PFI8

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Mfr.Part #
70V9159L7PFI8
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
TQFP
Datasheet
Download
Description
IC SRAM 72KBIT PARALLEL 100TQFP
Stock
14,297
In Stock :
14,297

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Mounting Type :
Surface Mount
Lead Free :
Contains Lead
Supplier Device Package :
100-TQFP (14x14)
Interface :
Parallel
Max Operating Temperature :
85°C
Temperature Grade :
Industrial
Sync/Async :
SYNCHRONOUS
Thickness :
1.4mm
Organization :
8KX9
JESD-609 Code :
e0
Min Operating Temperature :
-40°C
Operating Supply Voltage :
3.3V
I/O Type :
COMMON
Number of Pins :
100
Mount :
Surface Mount
Voltage - Supply :
3 V ~ 3.6 V
Peak Reflow Temperature (Cel) :
240
Packaging :
Tape and Reel
Supply Voltage :
3.3V
Terminal Position :
QUAD
Width :
14mm
Height Seated (Max) :
1.6mm
Access Time :
18 ns
Terminal Form :
Gull wing
Memory Type :
RAM, SRAM
Write Cycle Time - Word, Page :
--
Min Supply Voltage :
3V
Frequency :
45.45MHz
RoHS Status :
RoHS Compliant
Base Part Number :
IDT70V9159
Length :
14mm
Standby Voltage-Min :
3V
Output Characteristics :
3-STATE
Density :
72 kb
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Published :
2009
Max Supply Voltage :
3.6V
Number of Terminations :
100
Factory Lead Time :
7 Weeks
Pbfree Code :
No
Additional Feature :
FLOW-THROUGH OR PIPELINED ARCHITECTURE
Memory Size :
72Kb (8K x 9)
ECCN Code :
EAR99
Nominal Supply Current :
330mA
Memory Interface :
Parallel
Time@Peak Reflow Temperature-Max (s) :
20
Address Bus Width :
13b
Memory Format :
SRAM
Series :
--
Terminal Pitch :
0.5mm
Standby Current-Max :
0.003A
Word Size :
9b
Operating Temperature :
-40°C ~ 85°C (TA)
Radiation Hardening :
No
Number of Functions :
1
Number of Ports :
2
Package / Case :
TQFP
Pin Count :
100
Terminal Finish :
Tin/Lead (Sn85Pb15)
Datasheets
70V9159L7PFI8
Introducing Memory Intersil (Renesas Electronics Corporation) 70V9159L7PFI8 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Pins:100, Base Part Number:IDT70V9159, Number of Terminations:100, Operating Temperature:-40°C ~ 85°C (TA), Package / Case:TQFP, 70V9159L7PFI8 pinout, 70V9159L7PFI8 datasheet PDF, 70V9159L7PFI8 amp .Beyond Memory Intersil (Renesas Electronics Corporation) 70V9159L7PFI8 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 70V9159L7PFI8


Memory Intersil (Renesas Electronics Corporation) 70V9159L7PFI8 Overview

Introducing the Memory Intersil (Renesas Electronics Corporation) 70V9159L7PFI8, a high-performance IC SRAM designed for demanding applications that require robust, high-speed data storage and retrieval. This 72Kbit SRAM utilizes a parallel interface encapsulated in a compact 100TQFP package, offering an optimal balance of speed, reliability, and power efficiency. Tailored for advanced computing and networking systems, this memory module is crafted to support a wide array of industrial and commercial applications, ensuring superior performance and scalability. Its integration capabilities make it a cornerstone for system developers looking to enhance system integrity and operational efficiency.

70V9159L7PFI8 Features

The 70V9159L7PFI8 SRAM features include high data integrity with fast access time, which is essential for real-time computing environments. The 100TQFP packaging not only ensures a compact footprint but also aids in better thermal management and reduced electromagnetic interference, enhancing overall system robustness. Its parallel interface architecture facilitates quicker data transfer rates, making it ideal for systems requiring high-speed data processing and storage.

70V9159L7PFI8 Applications

  • Networking Equipment: Utilized in routers, switches, and other networking devices for fast data buffering and switching.
  • Industrial Automation: Acts as a reliable data storage in industrial control systems where processing speed and precision are critical.
  • Telecommunications: Supports telecommunications infrastructure by providing quick access to data, ensuring seamless service and connectivity.
  • High-performance Computing: Integral to supercomputers and high-performance servers for handling large volumes of data efficiently.
  • Aerospace and Defense: Used in mission-critical aerospace and defense applications where data integrity and speed are paramount.
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