70V9159L7PF

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Mfr.Part #
70V9159L7PF
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
TQFP
Datasheet
Download
Description
IC SRAM 72KBIT PARALLEL 100TQFP
Stock
24,088
In Stock :
24,088

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Published :
2009
Time@Peak Reflow Temperature-Max (s) :
20
Write Cycle Time - Word, Page :
--
Thickness :
1.4mm
Output Characteristics :
3-STATE
Terminal Form :
Gull wing
Word Size :
9b
Access Time :
18 ns
Memory Size :
72Kb (8K x 9)
Supplier Device Package :
100-TQFP (14x14)
Number of Functions :
1
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Series :
--
Interface :
Parallel
ECCN Code :
EAR99
RoHS Status :
RoHS Compliant
Memory Interface :
Parallel
Terminal Pitch :
0.5mm
Max Supply Voltage :
3.6V
Frequency :
45.45MHz
Standby Voltage-Min :
3V
Memory Type :
RAM, SRAM
Number of Terminations :
100
Mounting Type :
Surface Mount
Memory Format :
SRAM
Additional Feature :
FLOW-THROUGH OR PIPELINED ARCHITECTURE
Operating Temperature :
0°C ~ 70°C (TA)
Operating Supply Voltage :
3.3V
Nominal Supply Current :
280mA
Min Operating Temperature :
0°C
Max Operating Temperature :
70°C
Standby Current-Max :
0.003A
JESD-609 Code :
e0
Factory Lead Time :
7 Weeks
Packaging :
Tray
I/O Type :
COMMON
Temperature Grade :
COMMERCIAL
Address Bus Width :
26b
Peak Reflow Temperature (Cel) :
240
Mount :
Surface Mount
Number of Pins :
100
Min Supply Voltage :
3V
Base Part Number :
IDT70V9159
Supply Voltage :
3.3V
Organization :
8KX9
Radiation Hardening :
No
Density :
72 kb
Voltage - Supply :
3 V ~ 3.6 V
Width :
14mm
Sync/Async :
SYNCHRONOUS
Pbfree Code :
No
Pin Count :
100
Lead Free :
Contains Lead
Package / Case :
TQFP
Number of Ports :
2
Terminal Position :
QUAD
Length :
14mm
Terminal Finish :
Tin/Lead (Sn85Pb15)
Datasheets
70V9159L7PF
Introducing Memory Intersil (Renesas Electronics Corporation) 70V9159L7PF from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:100, Mounting Type:Surface Mount, Operating Temperature:0°C ~ 70°C (TA), Number of Pins:100, Base Part Number:IDT70V9159, Package / Case:TQFP, 70V9159L7PF pinout, 70V9159L7PF datasheet PDF, 70V9159L7PF amp .Beyond Memory Intersil (Renesas Electronics Corporation) 70V9159L7PF ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 70V9159L7PF


Memory Intersil (Renesas Electronics Corporation) 70V9159L7PF Overview

The Memory Intersil (Renesas Electronics Corporation) 70V9159L7PF is a high-performance SRAM chip designed to meet the demands of sophisticated electronic systems. Offering a substantial 72Kbit of storage, this device is housed in a compact 100TQFP package, ensuring it fits seamlessly into a variety of hardware applications. Engineered by Renesas Electronics, a leader in semiconductor solutions, this SRAM module delivers exceptional reliability and speed, crucial for applications requiring rapid access to memory. Its integration capabilities and robust performance make it an ideal choice for manufacturers looking to enhance their systems with efficient and reliable memory solutions.

70V9159L7PF Features

The 70V9159L7PF SRAM chip boasts several features critical for modern electronic applications. Key features include its parallel interface, offering quick data transfer speeds that are essential for high-performance computing environments. The chip's 100TQFP package is designed for optimal space efficiency and reliability in physical integration. Additionally, its low-power consumption makes it suitable for devices where power efficiency is paramount.

70V9159L7PF Applications

  • Advanced Computing Systems: Utilized in server and high-performance computing where fast access to volatile memory is critical for processing large volumes of data efficiently.
  • Networking Equipment: Plays a pivotal role in routers and switches, providing the necessary speed for buffering data and managing multiple data streams.
  • Telecommunications: Supports telecommunications infrastructure by speeding up signal processing and data management tasks.
  • Industrial Automation: Key in automation systems where quick memory access is necessary to handle complex operations and control tasks smoothly.
  • Automotive Electronics: Used in advanced automotive systems, enhancing the performance of navigation and driver assistance systems.
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