70V9159L7PF

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Mfr.Part #
70V9159L7PF
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
TQFP
Datasheet
Download
Description
IC SRAM 72KBIT PARALLEL 100TQFP
Stock
24,088
In Stock :
24,088

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Mount :
Surface Mount
Temperature Grade :
COMMERCIAL
Published :
2009
Pin Count :
100
Mounting Type :
Surface Mount
Standby Current-Max :
0.003A
RoHS Status :
RoHS Compliant
Interface :
Parallel
Number of Terminations :
100
Base Part Number :
IDT70V9159
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
ECCN Code :
EAR99
Length :
14mm
Lead Free :
Contains Lead
Number of Ports :
2
Pbfree Code :
No
Thickness :
1.4mm
Nominal Supply Current :
280mA
Access Time :
18 ns
Number of Functions :
1
Operating Temperature :
0°C ~ 70°C (TA)
Max Supply Voltage :
3.6V
Min Supply Voltage :
3V
Organization :
8KX9
Series :
--
Operating Supply Voltage :
3.3V
Factory Lead Time :
7 Weeks
Word Size :
9b
Terminal Form :
Gull wing
Memory Type :
RAM, SRAM
Packaging :
Tray
Width :
14mm
Number of Pins :
100
Write Cycle Time - Word, Page :
--
JESD-609 Code :
e0
Terminal Position :
QUAD
Voltage - Supply :
3 V ~ 3.6 V
Sync/Async :
SYNCHRONOUS
Output Characteristics :
3-STATE
Min Operating Temperature :
0°C
Max Operating Temperature :
70°C
Package / Case :
TQFP
Standby Voltage-Min :
3V
Additional Feature :
FLOW-THROUGH OR PIPELINED ARCHITECTURE
Radiation Hardening :
No
Supply Voltage :
3.3V
Supplier Device Package :
100-TQFP (14x14)
Terminal Pitch :
0.5mm
Terminal Finish :
Tin/Lead (Sn85Pb15)
Memory Size :
72Kb (8K x 9)
Address Bus Width :
26b
Memory Format :
SRAM
Memory Interface :
Parallel
I/O Type :
COMMON
Time@Peak Reflow Temperature-Max (s) :
20
Density :
72 kb
Frequency :
45.45MHz
Peak Reflow Temperature (Cel) :
240
Datasheets
70V9159L7PF
Introducing Memory Intersil (Renesas Electronics Corporation) 70V9159L7PF from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Terminations:100, Base Part Number:IDT70V9159, Operating Temperature:0°C ~ 70°C (TA), Number of Pins:100, Package / Case:TQFP, 70V9159L7PF pinout, 70V9159L7PF datasheet PDF, 70V9159L7PF amp .Beyond Memory Intersil (Renesas Electronics Corporation) 70V9159L7PF ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 70V9159L7PF


Memory Intersil (Renesas Electronics Corporation) 70V9159L7PF Overview

The Memory Intersil (Renesas Electronics Corporation) 70V9159L7PF is a high-performance SRAM chip designed to meet the demands of sophisticated electronic systems. Offering a substantial 72Kbit of storage, this device is housed in a compact 100TQFP package, ensuring it fits seamlessly into a variety of hardware applications. Engineered by Renesas Electronics, a leader in semiconductor solutions, this SRAM module delivers exceptional reliability and speed, crucial for applications requiring rapid access to memory. Its integration capabilities and robust performance make it an ideal choice for manufacturers looking to enhance their systems with efficient and reliable memory solutions.

70V9159L7PF Features

The 70V9159L7PF SRAM chip boasts several features critical for modern electronic applications. Key features include its parallel interface, offering quick data transfer speeds that are essential for high-performance computing environments. The chip's 100TQFP package is designed for optimal space efficiency and reliability in physical integration. Additionally, its low-power consumption makes it suitable for devices where power efficiency is paramount.

70V9159L7PF Applications

  • Advanced Computing Systems: Utilized in server and high-performance computing where fast access to volatile memory is critical for processing large volumes of data efficiently.
  • Networking Equipment: Plays a pivotal role in routers and switches, providing the necessary speed for buffering data and managing multiple data streams.
  • Telecommunications: Supports telecommunications infrastructure by speeding up signal processing and data management tasks.
  • Industrial Automation: Key in automation systems where quick memory access is necessary to handle complex operations and control tasks smoothly.
  • Automotive Electronics: Used in advanced automotive systems, enhancing the performance of navigation and driver assistance systems.
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