70V659S12DR

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Mfr.Part #
70V659S12DR
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
PQFP
Datasheet
Download
Description
IC SRAM 4.5MBIT PARALLEL 208PQFP
Stock
31,548
In Stock :
31,548

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Operating Temperature :
0°C ~ 70°C (TA)
Thickness :
3.5mm
Pbfree Code :
No
Interface :
Parallel
I/O Type :
COMMON
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Height Seated (Max) :
4.1mm
Number of Functions :
1
Terminal Finish :
Tin/Lead (Sn/Pb)
Terminal Pitch :
0.5mm
Access Time :
12 ns
Nominal Supply Current :
465mA
Max Operating Temperature :
70°C
Lead Free :
Contains Lead
Density :
4.5 Mb
Published :
2009
Number of Pins :
208
RoHS Status :
RoHS Compliant
Terminal Form :
Gull wing
Number of Terminations :
208
Standby Current-Max :
0.015A
Mount :
Surface Mount
Min Operating Temperature :
0°C
Base Part Number :
IDT70V659
JESD-609 Code :
e0
Sync/Async :
ASYNCHRONOUS
Temperature Grade :
COMMERCIAL
Word Size :
36b
Number of Ports :
2
Output Characteristics :
3-STATE
Address Bus Width :
34b
Min Supply Voltage :
3.15V
Operating Supply Voltage :
3.3V
Memory Size :
512kB
Peak Reflow Temperature (Cel) :
225
Width :
28mm
Package / Case :
PQFP
Length :
28mm
Voltage - Supply :
3.15 V ~ 3.45 V
Memory Format :
SRAM
Mounting Type :
Surface Mount
Memory Type :
RAM, SDR, SRAM
Write Cycle Time - Word, Page :
12ns
Supply Voltage :
3.3V
Radiation Hardening :
No
Max Supply Voltage :
3.45V
Max Supply Current :
465mA
Time@Peak Reflow Temperature-Max (s) :
20
Factory Lead Time :
7 Weeks
Pin Count :
208
Terminal Position :
QUAD
Supplier Device Package :
208-PQFP (28x28)
Packaging :
Tray
Memory Interface :
Parallel
Series :
--
Datasheets
70V659S12DR
Introducing Memory Intersil (Renesas Electronics Corporation) 70V659S12DR from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C ~ 70°C (TA), Number of Pins:208, Number of Terminations:208, Base Part Number:IDT70V659, Package / Case:PQFP, Mounting Type:Surface Mount, 70V659S12DR pinout, 70V659S12DR datasheet PDF, 70V659S12DR amp .Beyond Memory Intersil (Renesas Electronics Corporation) 70V659S12DR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 70V659S12DR


Memory Intersil (Renesas Electronics Corporation) 70V659S12DR Overview

Unlock the potential of high-speed and high-capacity data storage with the Memory Intersil (Renesas Electronics Corporation) 70V659S12DR SRAM chip. This robust IC features a significant 4.5Mbit storage capacity and is packed into a compact 208PQFP package, offering a solution optimized for performance and reliability in complex applications. The integration of this advanced technology supports critical real-time processing and storage demands, making it an ideal component for manufacturers looking to enhance their products with reliable memory management capabilities. Its parallel interface ensures quick data access and seamless integration into existing architectures, highlighting its versatility and superior design.

70V659S12DR Features

The 70V659S12DR SRAM chip by Intersil (Renesas Electronics Corporation) delivers exceptional features that include 4.5MBIT of parallel SRAM, housed in a practical 208PQFP package. This component ensures rapid access speeds and is designed for low-power operation, facilitating extended operational efficiency and stability. Its parallel interface not only accelerates the throughput but also simplifies the system design, allowing for easier integration into various industrial applications.

70V659S12DR Applications

  • Advanced Networking Equipment: Utilized in routers and switches to manage routing tables more efficiently, enhancing network performance and reliability.
  • High-performance Computing: Employs in servers and supercomputers for fast data buffering and cache solutions, supporting intensive computational tasks and data analysis.
  • Automotive Electronics: Integrated into automotive systems for managing real-time vehicle telemetry and infotainment systems, improving responsiveness and user experience.
  • Industrial Automation: Applied in PLCs and industrial PCs to handle complex processes and control tasks, increasing the reliability and efficiency of automated systems.
  • Telecommunications: Used in telecommunications infrastructure to enhance data processing capabilities, supporting high-speed data transmission and signal processing.
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