70V659S10DR

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Mfr.Part #
70V659S10DR
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
208-BFQFP
Datasheet
Download
Description
IC SRAM 4.5MBIT PARALLEL 208PQFP
Stock
9,299
In Stock :
9,299

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Memory Interface :
Parallel
Mounting Type :
Surface Mount
Write Cycle Time - Word, Page :
10ns
Memory Type :
Volatile
Package / Case :
208-BFQFP
Voltage - Supply :
3.15V~3.45V
Factory Lead Time :
10 Weeks
Memory Size :
4.5Mb 128K x 36
RoHS Status :
ROHS3 Compliant
Memory Format :
SRAM
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Packaging :
Tray
Operating Temperature :
0°C~70°C TA
Datasheets
70V659S10DR
Introducing Memory Intersil (Renesas Electronics Corporation) 70V659S10DR from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:208-BFQFP, Operating Temperature:0°C~70°C TA, 70V659S10DR pinout, 70V659S10DR datasheet PDF, 70V659S10DR amp .Beyond Memory Intersil (Renesas Electronics Corporation) 70V659S10DR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 70V659S10DR


Memory Intersil (Renesas Electronics Corporation) 70V659S10DR Overview

The Memory Intersil (Renesas Electronics Corporation) 70V659S10DR is a high-performance, 4.5Mbit SRAM device, housed in a compact 208-PQFP package. This memory component is designed to meet the demanding requirements of advanced telecommunications and industrial applications, where fast access and high bandwidth are crucial. The SRAM provides a reliable and robust storage solution that operates effectively across a variety of environmental conditions, making it an ideal choice for critical systems that require durable and consistent performance.

70V659S10DR Features

This SRAM module boasts several key features that make it highly effective for sophisticated electronics. It supports a parallel interface, allowing for quick and efficient data handling and retrieval. The 208-PQFP package ensures that the module can be integrated into systems with limited space, while maintaining excellent thermal stability and reduced power consumption. Additionally, the device’s ability to operate over a wide temperature range enhances its versatility in different operating environments.

70V659S10DR Applications

  • Telecommunication Systems: Utilized for high-speed data buffering and temporary data storage, ensuring smooth data flow and system reliability in communication infrastructures.
  • Industrial Automation: Acts as a dependable solution for process control, where quick data access is crucial for real-time system responses.
  • Networking Equipment: Serves in routers and switches for packet buffering, enabling efficient packet management and throughput in complex network scenarios.
  • Medical Imaging Systems: Provides rapid access to image data, supporting high-resolution and real-time imaging processes essential in medical diagnostics.
  • Aerospace and Defense: Employed in systems requiring rugged memory solutions that can perform under extreme environmental conditions and critical missions.
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