70V658S10BFG

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Mfr.Part #
70V658S10BFG
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
208-LFBGA
Datasheet
Download
Description
IC SRAM 2MBIT PARALLEL 208FPBGA
Stock
2,564
In Stock :
2,564

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Package / Case :
208-LFBGA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Write Cycle Time - Word, Page :
10ns
Packaging :
Tray
Operating Temperature :
0°C~70°C TA
Factory Lead Time :
10 Weeks
Base Part Number :
IDT70V658
RoHS Status :
ROHS3 Compliant
Memory Interface :
Parallel
Memory Format :
SRAM
Mounting Type :
Surface Mount
Voltage - Supply :
3.15V~3.45V
Memory Type :
Volatile
Memory Size :
2Mb 64K x 36
Datasheets
70V658S10BFG
Introducing Memory Intersil (Renesas Electronics Corporation) 70V658S10BFG from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:208-LFBGA, Operating Temperature:0°C~70°C TA, Base Part Number:IDT70V658, Mounting Type:Surface Mount, 70V658S10BFG pinout, 70V658S10BFG datasheet PDF, 70V658S10BFG amp .Beyond Memory Intersil (Renesas Electronics Corporation) 70V658S10BFG ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 70V658S10BFG


Memory Intersil (Renesas Electronics Corporation) 70V658S10BFG Overview

The Memory Intersil (Renesas Electronics Corporation) 70V658S10BFG is a high-performance SRAM component designed for advanced embedded systems requiring fast access and large volumes of data. With its 2Mbit capacity and parallel interface, this IC provides robust data integrity and speed, making it ideal for demanding applications in the industrial, telecommunications, and networking sectors. Encased in a 208FPBGA package, it ensures reliable operation even under stringent conditions, supporting the high-density integration requirements of modern electronic designs.

70V658S10BFG Features

This SRAM IC boasts several features that make it an excellent choice for developers looking to optimize their systems for performance and reliability. Key features include:

  • 2Mbit memory capacity for substantial data management.
  • Parallel interface ensuring high-speed data transfer and processing.
  • Compact 208FPBGA package, facilitating efficient space utilization on PCBs.
  • Designed for low-power operation to extend the lifespan of battery-powered devices.

70V658S10BFG Applications

  • Advanced Networking Equipment: Utilized in routers and switches for fast data buffering and throughput.
  • Telecommunication Infrastructure: Integrated into telecommunications hardware to manage real-time data exchanges and signaling.
  • Industrial Automation Systems: Supports complex industrial control systems with rapid access to data, enhancing automation and process control.
  • High-performance Computing: Used in servers and workstations to accelerate processing capabilities and improve system responsiveness.
  • Automotive Electronics: Serves critical roles in automotive applications, including advanced driver-assistance systems (ADAS) and infotainment systems, for better performance and reliability.
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Shipping Method

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Shipping Cost

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The basic freight (for package ≤0.5 KG ) depends on the time zones and countries

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.

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