70V35S20PF8

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Mfr.Part #
70V35S20PF8
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
TQFP
Datasheet
Download
Description
IC SRAM 144K PARALLEL 100TQFP
Stock
3,572
In Stock :
3,572

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Time@Peak Reflow Temperature-Max (s) :
20
Memory Interface :
Parallel
Min Supply Voltage :
3V
Thickness :
1.4mm
Height Seated (Max) :
1.6mm
Peak Reflow Temperature (Cel) :
240
Mounting Type :
Surface Mount
JESD-609 Code :
e0
Memory Size :
18kb
Series :
--
Sync/Async :
ASYNCHRONOUS
Pin Count :
100
Published :
2008
Packaging :
Tape and Reel (TR)
Terminal Form :
Gull wing
Radiation Hardening :
No
Length :
14mm
Pbfree Code :
No
Supply Voltage :
3.3V
Voltage - Supply :
3 V ~ 3.6 V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Format :
SRAM
Package / Case :
TQFP
Width :
14mm
Organization :
8KX18
Word Size :
18b
Write Cycle Time - Word, Page :
20ns
Standby Current-Max :
0.005A
Memory Type :
RAM, SDR, SRAM
Access Time :
20 ns
I/O Type :
COMMON
Output Characteristics :
3-STATE
Number of Pins :
100
ECCN Code :
EAR99
Nominal Supply Current :
200mA
Supplier Device Package :
100-TQFP (14x14)
Factory Lead Time :
7 Weeks
Number of Terminations :
100
RoHS Status :
RoHS Compliant
Interface :
Parallel
Terminal Pitch :
0.5mm
Address Bus Width :
26b
Min Operating Temperature :
0°C
Number of Functions :
1
Temperature Grade :
COMMERCIAL
Density :
144 kb
Operating Supply Voltage :
3.3V
Number of Ports :
2
Terminal Finish :
Tin/Lead (Sn85Pb15)
Max Supply Voltage :
3.6V
Operating Temperature :
0°C ~ 70°C (TA)
Lead Free :
Contains Lead
Mount :
Surface Mount
Base Part Number :
IDT70V35
Standby Voltage-Min :
3V
Max Operating Temperature :
70°C
Terminal Position :
QUAD
Datasheets
70V35S20PF8
Introducing Memory Intersil (Renesas Electronics Corporation) 70V35S20PF8 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:TQFP, Number of Pins:100, Number of Terminations:100, Operating Temperature:0°C ~ 70°C (TA), Base Part Number:IDT70V35, 70V35S20PF8 pinout, 70V35S20PF8 datasheet PDF, 70V35S20PF8 amp .Beyond Memory Intersil (Renesas Electronics Corporation) 70V35S20PF8 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 70V35S20PF8


Memory Intersil (Renesas Electronics Corporation) 70V35S20PF8 Overview

The Memory Intersil (Renesas Electronics Corporation) 70V35S20PF8 is a high-performance IC SRAM that offers a robust storage solution with a capacity of 144K. Designed in a compact 100TQFP package, this parallel interface SRAM is engineered for high-speed data retrieval and exceptional reliability under a variety of operating conditions. This makes it an ideal choice for advanced industrial applications requiring fast access and stable memory performance. Its integration facilitates improved system efficiency and supports complex computational demands with ease.

70V35S20PF8 Features

This SRAM chip features a parallel interface for quick data access and high throughput, supporting advanced memory-intensive applications. The 100TQFP packaging not only ensures a reduced footprint on system boards but also enhances thermal stability and durability. The device's architecture allows for seamless integration into existing technology stacks, making it a versatile choice for designers and engineers looking to optimize their hardware solutions.

70V35S20PF8 Applications

  • Advanced Computing Systems: Utilized in server farms and high-performance computing environments where rapid data access is critical.
  • Embedded Systems: Serves as the main storage component in embedded systems for automotive and industrial machine control units, facilitating reliable and quick data processing.
  • Networking Equipment: Essential in networking hardware such as routers and switches for buffer memory, helping manage data flow efficiently.
  • Telecommunications: Used in telecom infrastructure to store firmware and operational data, ensuring swift access to information needed for system operations.
  • Consumer Electronics: Integrated into consumer electronics like digital cameras and gaming consoles, enhancing user experience through improved performance and faster system responsiveness.
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