70V3589S133BCI

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Mfr.Part #
70V3589S133BCI
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
256-LBGA
Datasheet
Download
Description
IC SRAM 2MBIT PARALLEL 256CABGA
Stock
13,364
In Stock :
13,364

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Operating Temperature :
-40°C~85°C TA
Memory Size :
2Mb 64K x 36
Voltage - Supply :
3.15V~3.45V
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Memory Interface :
Parallel
Memory Type :
Volatile
Access Time :
4.2ns
Mounting Type :
Surface Mount
Factory Lead Time :
10 Weeks
Clock Frequency :
133MHz
Packaging :
Tray
Package / Case :
256-LBGA
Supplier Device Package :
256-CABGA (17x17)
Memory Format :
SRAM
RoHS Status :
Non-RoHS Compliant
Base Part Number :
IDT70V3589
Datasheets
70V3589S133BCI
Introducing Memory Intersil (Renesas Electronics Corporation) 70V3589S133BCI from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C TA, Mounting Type:Surface Mount, Package / Case:256-LBGA, Base Part Number:IDT70V3589, 70V3589S133BCI pinout, 70V3589S133BCI datasheet PDF, 70V3589S133BCI amp .Beyond Memory Intersil (Renesas Electronics Corporation) 70V3589S133BCI ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 70V3589S133BCI


Memory Intersil (Renesas Electronics Corporation) 70V3589S133BCI Overview

The Memory Intersil (Renesas Electronics Corporation) 70V3589S133BCI is a high-performance integrated circuit specifically designed to meet the demanding requirements of advanced digital systems. This IC SRAM features a robust 2Mbit storage capacity and utilizes a parallel interface, encapsulated in a dense 256CABGA package. Engineered for optimal reliability and speed, it is ideal for applications requiring quick access to large volumes of data. The integration of this memory component ensures enhanced system performance with its high data integrity and low power consumption, making it a prime choice for B2B customers looking to scale operations and enhance product performance.

70V3589S133BCI Features

This SRAM chip boasts several features designed to offer superior performance and ease of integration. Key features include a large 2MB memory capacity for extensive data storage, a parallel interface ensuring fast data transfer rates, and a compact 256CABGA package that minimizes space usage on PCBs while supporting dense circuit designs. Additionally, the IC offers low latency and high-speed access, critical for real-time applications.

70V3589S133BCI Applications

  • Advanced Computing Systems: Used in servers and high-performance computing platforms to enhance processing speeds by providing fast, temporary data storage that accelerates data retrieval and execution.
  • Telecommunications Equipment: Integral in communication infrastructure, aiding in the quick processing of information and supporting complex telecommunications systems.
  • Industrial Automation: Facilitates the operation of machinery and control systems by storing and managing operational data, enhancing automation process reliability and speed.
  • Automotive Electronics: Applied in advanced driver-assistance systems (ADAS) and other in-vehicle networks to improve response times and reliability in critical vehicle functions.
  • Aerospace and Defense: Used in applications where high data integrity and fast access are crucial, such as in navigation systems and avionic computers.
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