70V3319S166BF8

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Mfr.Part #
70V3319S166BF8
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
208-LFBGA
Datasheet
Download
Description
IC SRAM 4.5MBIT PAR 208CABGA
Stock
43,140
In Stock :
43,140

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Operating Temperature :
0°C~70°C TA
Memory Interface :
Parallel
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
RoHS Status :
Non-RoHS Compliant
Factory Lead Time :
12 Weeks
Access Time :
3.6ns
Memory Format :
SRAM
Memory Type :
Volatile
Base Part Number :
IDT70V3319
Memory Size :
4.5Mb 256K x 18
Clock Frequency :
166MHz
Package / Case :
208-LFBGA
Voltage - Supply :
3.15V~3.45V
Packaging :
Tape and Reel (TR)
Mounting Type :
Surface Mount
Supplier Device Package :
208-CABGA (15x15)
Datasheets
70V3319S166BF8
Introducing Memory Intersil (Renesas Electronics Corporation) 70V3319S166BF8 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~70°C TA, Base Part Number:IDT70V3319, Package / Case:208-LFBGA, Mounting Type:Surface Mount, 70V3319S166BF8 pinout, 70V3319S166BF8 datasheet PDF, 70V3319S166BF8 amp .Beyond Memory Intersil (Renesas Electronics Corporation) 70V3319S166BF8 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 70V3319S166BF8


Memory Intersil (Renesas Electronics Corporation) 70V3319S166BF8 Overview

The Memory Intersil (Renesas Electronics Corporation) 70V3319S166BF8 is a high-performance IC SRAM with a storage capacity of 4.5Mbit, encapsulated in a robust 208CABGA package. This advanced memory solution is designed to meet the rigorous demands of high-speed data environments, offering reliable and swift data access. Engineered for optimal efficiency and reliability, this SRAM module stands out in the marketplace for its integration of leading-edge technology with the trusted engineering excellence of Intersil, now part of Renesas Electronics Corporation. Its substantial storage capacity and fast access times make it an ideal choice for sophisticated electronic systems requiring high-speed memory for buffering and data storage purposes.

70V3319S166BF8 Features

This SRAM component features parallel interface capabilities, ensuring seamless integration into existing architectures without compromising on speed or data integrity. Its large 4.5Mbit capacity is well-suited for applications needing extensive temporary data storage, while the compact 208CABGA package guarantees minimal space usage with maximal functionality. The memory module's robust design ensures it operates reliably across various temperature ranges, making it suitable for diverse industrial applications.

70V3319S166BF8 Applications

  • Advanced Computing Systems: Used for high-speed data caching to enhance the overall efficiency and performance of complex computing systems.
  • Networking Equipment: Serves as buffer memory in routers and switches, facilitating fast data throughput and improved network reliability.
  • Industrial Automation: Provides reliable data storage and access in automation controllers, ensuring precise control and monitoring of industrial processes.
  • Telecommunications Infrastructure: Utilized in telecom systems for quick data access, supporting faster signal processing and improved system responsiveness.
  • Aerospace and Defense: Offers robust, reliable memory solutions capable of withstanding the demanding conditions found in aerospace and defense applications.
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