70V261L55PF8
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- Mfr.Part #
- 70V261L55PF8
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- TQFP
- Datasheet
- Download
- Description
- IC SRAM 256KBIT PARALLEL 100TQFP
- Stock
- 25,585
- In Stock ：
- 25,585
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- Memory
- Min Supply Voltage :
- 3V
- Package / Case :
- TQFP
- Operating Supply Voltage :
- 3.3V
- Address Bus Width :
- 14b
- Peak Reflow Temperature (Cel) :
- 240
- Memory Size :
- 32kB
- Additional Feature :
- INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
- Access Time :
- 55 ns
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Pins :
- 100
- Temperature Grade :
- COMMERCIAL
- Pbfree Code :
- No
- I/O Type :
- COMMON
- Word Size :
- 16b
- Memory Type :
- RAM, SDR, SRAM
- JESD-609 Code :
- e0
- Supply Voltage :
- 3.3V
- Min Operating Temperature :
- 0°C
- Standby Current-Max :
- 0.003A
- Terminal Position :
- QUAD
- Width :
- 14mm
- Max Operating Temperature :
- 70°C
- Standby Voltage-Min :
- 3V
- Sync/Async :
- ASYNCHRONOUS
- Pin Count :
- 100
- ECCN Code :
- EAR99
- Length :
- 14mm
- Number of Ports :
- 2
- Number of Functions :
- 1
- Density :
- 256 kb
- Interface :
- Parallel
- Organization :
- 16KX16
- Lead Free :
- Contains Lead
- RoHS Status :
- RoHS Compliant
- Max Supply Voltage :
- 3.6V
- Number of Terminations :
- 100
- Published :
- 2001
- Nominal Supply Current :
- 120mA
- Mount :
- Surface Mount
- Terminal Form :
- Gull wing
- Factory Lead Time :
- 7 Weeks
- Height Seated (Max) :
- 1.6mm
- Thickness :
- 1.4mm
- Terminal Pitch :
- 0.5mm
- Output Characteristics :
- 3-STATE
- Radiation Hardening :
- No
- Time@Peak Reflow Temperature-Max (s) :
- 20
- Terminal Finish :
- Tin/Lead (Sn85Pb15)
- Datasheets
- 70V261L55PF8
Memory Intersil (Renesas Electronics Corporation) 70V261L55PF8 Overview
The Memory Intersil (Renesas Electronics Corporation) 70V261L55PF8 is a high-performance SRAM device designed to meet the demands of advanced computing and storage systems. With a dense 256Kbit capacity and a robust 100TQFP packaging, this IC offers exceptional durability and functionality. Its design facilitates reliable high-speed operation, making it ideal for applications requiring rapid access to large volumes of data. The parallel interface ensures ease of integration into existing architectures, enhancing system performance without compromising on space or power efficiency.
70V261L55PF8 Features
This SRAM chip features a parallel interface for high-speed data transfer and low-latency operations. It is encapsulated in a compact 100TQFP package that minimizes space on the printed circuit board and simplifies the assembly process. The chip's design focuses on reducing power consumption while maintaining high data integrity and operational speed, suitable for power-sensitive applications.
70V261L55PF8 Applications
- Networking Equipment: Utilized in routers and switches, the 70V261L55PF8 enhances packet buffering capabilities, ensuring efficient data flow and reduced latency across networks.
- Telecommunications Systems: Supports the demands of telecommunications infrastructure by providing high-speed, reliable caching of user data and system information.
- Industrial Automation: In automation controllers and systems, this SRAM serves as a dynamic memory for real-time process control, improving system responsiveness and reliability.
- Automotive Applications: Integral in advanced driver-assistance systems (ADAS) where quick access to data is crucial for decision-making processes.
- Consumer Electronics: Applied in high-performance gaming consoles and computers, offering enhanced graphics rendering and faster processing capabilities.
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