70V261L55PF

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Mfr.Part #
70V261L55PF
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
TQFP
Datasheet
Download
Description
IC SRAM 256KBIT PARALLEL 100TQFP
Stock
18,167
In Stock :
18,167

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Number of Pins :
100
Interface :
Parallel
Word Size :
16b
Memory Size :
32kB
Nominal Supply Current :
120mA
Length :
14mm
Min Operating Temperature :
0°C
Thickness :
1.4mm
Mount :
Surface Mount
Width :
14mm
Memory Type :
RAM, SDR, SRAM
Number of Ports :
2
Max Operating Temperature :
70°C
Max Supply Voltage :
3.6V
Published :
2009
Lead Free :
Contains Lead
Factory Lead Time :
7 Weeks
Operating Supply Voltage :
3.3V
Address Bus Width :
28b
Min Supply Voltage :
3V
Sync/Async :
ASYNCHRONOUS
Density :
256 kb
Radiation Hardening :
No
RoHS Status :
RoHS Compliant
Package / Case :
TQFP
Access Time :
55 ns
Datasheets
70V261L55PF
Introducing Memory Intersil (Renesas Electronics Corporation) 70V261L55PF from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:100, Package / Case:TQFP, 70V261L55PF pinout, 70V261L55PF datasheet PDF, 70V261L55PF amp .Beyond Memory Intersil (Renesas Electronics Corporation) 70V261L55PF ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 70V261L55PF


Memory Intersil (Renesas Electronics Corporation) 70V261L55PF Overview

The Memory Intersil (Renesas Electronics Corporation) 70V261L55PF is a high-performance IC SRAM with a storage capacity of 256Kbit, encapsulated in a compact 100TQFP package. Designed to meet the rigorous demands of advanced computing and high-speed processing environments, this SRAM component offers exceptional reliability and speed. Its parallel interface ensures quick data access and throughput, making it an ideal choice for applications requiring fast and efficient memory operations. Its robust design and advanced manufacturing techniques underscore Intersil's commitment to providing cutting-edge memory solutions that enhance system performance and reliability.

70V261L55PF Features

The 70V261L55PF SRAM features include high data integrity, low power consumption, and the ability to operate at a wide range of industrial temperatures. This memory module is engineered to deliver high-speed data access, with robust tolerance against environmental conditions, ensuring uninterrupted performance even under stringent operational demands.

70V261L55PF Applications

  • Advanced Computing Systems: Utilized in server and high-performance computing environments for its fast access times and high data throughput capabilities.
  • Embedded Systems: Ideal for use in embedded applications due to its compact size and reliability in managing data-intensive operations.
  • Telecommunications: Supports the needs of telecommunications infrastructure by providing reliable and rapid memory access required for network hardware.
  • Automotive Electronics: Applied in automotive systems where high-speed and robust memory is crucial for real-time processing and control.
  • Aerospace and Defense: Suitable for aerospace and defense applications where memory integrity and performance are critical under extreme conditions.
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