70V25L55PF

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Mfr.Part #
70V25L55PF
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
TQFP
Datasheet
Download
Description
IC SRAM 128KBIT PARALLEL 100TQFP
Stock
47,211
In Stock :
47,211

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Additional Feature :
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
Time@Peak Reflow Temperature-Max (s) :
20
Length :
14mm
Operating Supply Voltage :
3.3V
Supply Voltage :
3.3V
Terminal Finish :
Tin/Lead (Sn85Pb15)
Organization :
8KX16
Word Size :
16b
Address Bus Width :
26b
RoHS Status :
RoHS Compliant
Memory Size :
16kB
JESD-609 Code :
e0
Temperature Grade :
COMMERCIAL
Package / Case :
TQFP
Standby Voltage-Min :
3V
Published :
2008
Lead Free :
Contains Lead
Density :
128 kb
Height Seated (Max) :
1.6mm
Min Supply Voltage :
3V
Min Operating Temperature :
0°C
Pin Count :
100
Pbfree Code :
No
Number of Pins :
100
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Position :
QUAD
Output Characteristics :
3-STATE
Peak Reflow Temperature (Cel) :
240
I/O Type :
COMMON
Memory Type :
RAM, SDR, SRAM
Radiation Hardening :
No
Number of Functions :
1
Terminal Form :
Gull wing
Number of Ports :
2
Max Operating Temperature :
70°C
Width :
14mm
Max Supply Voltage :
3.6V
Interface :
Parallel
Number of Terminations :
100
Mount :
Surface Mount
Thickness :
1.4mm
Sync/Async :
ASYNCHRONOUS
Nominal Supply Current :
155mA
Factory Lead Time :
7 Weeks
Terminal Pitch :
0.5mm
ECCN Code :
EAR99
Access Time :
55 ns
Datasheets
70V25L55PF
Introducing Memory Intersil (Renesas Electronics Corporation) 70V25L55PF from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:TQFP, Number of Pins:100, Number of Terminations:100, 70V25L55PF pinout, 70V25L55PF datasheet PDF, 70V25L55PF amp .Beyond Memory Intersil (Renesas Electronics Corporation) 70V25L55PF ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 70V25L55PF


Memory Intersil (Renesas Electronics Corporation) 70V25L55PF Overview

The Memory Intersil (Renesas Electronics Corporation) 70V25L55PF is a high-performance IC SRAM with a 128Kbit capacity, ideal for demanding applications requiring fast access and reliable data storage. Packaged in a compact 100TQFP, this memory chip is designed to deliver top-tier performance while maintaining low power consumption and high reliability. Its parallel interface ensures easy integration into existing architectures, making it a versatile choice for designers and engineers looking to enhance system capabilities. This SRAM's robust feature set makes it particularly suitable for high-speed computing environments where efficiency and speed are paramount.

70V25L55PF Features

This SRAM IC offers a substantial 128Kbit storage capacity, facilitated by its parallel communication interface that provides high-speed data transfer rates. The 100TQFP packaging not only ensures a minimal footprint on system boards but also enhances the thermal management and durability of the device. With its built-in features designed for ease of use and integration, the 70V25L55PF stands out as an optimal solution for advanced memory requirements in both commercial and industrial applications.

70V25L55PF Applications

  • Embedded Systems: Utilized in microcontroller-based applications, where quick data retrieval is critical to performance and functionality.
  • Telecommunications: Serves as buffer memory in switches and routers, aiding in the efficient handling of data packets in network communication.
  • Automotive Electronics: Used in automotive infotainment systems to enhance response times and reliability in multimedia applications.
  • Industrial Automation: Supports reliable operations in industrial control systems, where durability and the ability to operate under extreme conditions are necessary.
  • Consumer Electronics: Provides fast and reliable storage in consumer devices like digital cameras and gaming consoles, improving overall device responsiveness.
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