70V24S55PF8
- Mfr.Part #
- 70V24S55PF8
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- TQFP
- Datasheet
- Download
- Description
- IC SRAM 64KBIT PARALLEL 100TQFP
- Stock
- 17,770
- In Stock :
- 17,770
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- Memory
- Package / Case :
- TQFP
- Min Operating Temperature :
- 0°C
- Factory Lead Time :
- 7 Weeks
- Density :
- 64 kb
- Max Operating Temperature :
- 70°C
- Memory Size :
- 8kB
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Published :
- 2004
- Access Time :
- 55 ns
- Height Seated (Max) :
- 1.6mm
- Terminal Finish :
- Tin/Lead (Sn85Pb15)
- Operating Supply Voltage :
- 3.3V
- Max Supply Voltage :
- 3.6V
- Supply Voltage :
- 3.3V
- I/O Type :
- COMMON
- Terminal Position :
- QUAD
- Address Bus Width :
- 24b
- Temperature Grade :
- COMMERCIAL
- Output Characteristics :
- 3-STATE
- Min Supply Voltage :
- 3V
- JESD-609 Code :
- e0
- Width :
- 14mm
- Pin Count :
- 100
- Number of Functions :
- 1
- ECCN Code :
- EAR99
- Supply Current-Max :
- 0.18mA
- Interface :
- Parallel
- Number of Pins :
- 100
- Number of Ports :
- 2
- Terminal Pitch :
- 0.5mm
- Standby Voltage-Min :
- 3V
- Additional Feature :
- INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
- Time@Peak Reflow Temperature-Max (s) :
- 20
- RoHS Status :
- RoHS Compliant
- Standby Current-Max :
- 0.005A
- Peak Reflow Temperature (Cel) :
- 240
- Number of Terminations :
- 100
- Length :
- 14mm
- Terminal Form :
- Gull wing
- Pbfree Code :
- No
- Organization :
- 4KX16
- Radiation Hardening :
- No
- Surface Mount :
- yes
- Memory Type :
- RAM, SDR, SRAM
- Thickness :
- 1.4mm
- Lead Free :
- Contains Lead
- Datasheets
- 70V24S55PF8

Memory Intersil (Renesas Electronics Corporation) 70V24S55PF8 Overview
The Memory Intersil (Renesas Electronics Corporation) 70V24S55PF8 is a high-performance IC SRAM with a 64Kbit storage capacity, housed in a compact 100TQFP package. Designed for applications requiring fast access and reliable data storage, this product integrates advanced SRAM technology, ensuring robust parallel communication capabilities. It's an excellent choice for businesses looking to implement efficient and high-speed memory solutions in their systems, promising not only performance but also long-term reliability. This overview seeks to detail the capabilities and benefits of the 70V24S55PF8, making it a prime candidate for volume purchase and integration into sophisticated electronic systems.
70V24S55PF8 Features
The 70V24S55PF8 SRAM features a parallel interface, providing quick data access and high throughput capabilities. The 100TQFP packaging not only allows for a reduced footprint on PCB designs but also enhances the thermal management and reliability of the device. This SRAM chip is particularly noted for its low power consumption and stable operation under a broad range of environmental conditions, making it suitable for both industrial and commercial applications.
70V24S55PF8 Applications
- Telecommunications Equipment: Utilizes high-speed SRAM for buffering data during high-frequency transmission processes.
- Automotive Electronics: Provides reliable and fast data storage for advanced driver-assistance systems (ADAS) and other in-vehicle networks.
- Industrial Control Systems: Enhances performance in PLCs and CNC machines through efficient task handling and data logging.
- Consumer Electronics: Employs in devices such as set-top boxes and gaming consoles to improve user experience through faster data access.
- Networking Hardware: Used in routers and switches for efficient packet buffering, ensuring smooth data flow and reduced latency.
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