70V07S25PF

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Mfr.Part #
70V07S25PF
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
TQFP
Datasheet
Download
Description
IC SRAM 256KBIT PARALLEL 80TQFP
Stock
18,039
In Stock :
18,039

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Series :
--
Temperature Grade :
COMMERCIAL
RoHS Status :
RoHS Compliant
Thickness :
1.4mm
Supply Voltage :
3.3V
Peak Reflow Temperature (Cel) :
240
Supplier Device Package :
80-TQFP (14x14)
Output Characteristics :
3-STATE
ECCN Code :
EAR99
Additional Feature :
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
Min Supply Voltage :
3V
Voltage - Supply :
3 V ~ 3.6 V
Length :
14mm
Nominal Supply Current :
170mA
Package / Case :
TQFP
Factory Lead Time :
7 Weeks
Memory Interface :
Parallel
Interface :
Parallel
Memory Type :
RAM, SDR, SRAM
Packaging :
Tray
Height Seated (Max) :
1.6mm
Operating Supply Voltage :
3.3V
Write Cycle Time - Word, Page :
25ns
Operating Temperature :
0°C ~ 70°C (TA)
Standby Current-Max :
0.006A
Published :
2005
Density :
256 kb
Number of Ports :
2
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Min Operating Temperature :
0°C
Qualification Status :
Not Qualified
Number of Pins :
80
Standby Voltage-Min :
3V
Terminal Position :
QUAD
Word Size :
8B
Sync/Async :
ASYNCHRONOUS
Number of Functions :
1
Terminal Finish :
Tin/Lead (Sn85Pb15)
Pbfree Code :
No
Memory Format :
SRAM
Terminal Form :
Gull wing
Number of Terminations :
80
Max Operating Temperature :
70°C
Mounting Type :
Surface Mount
Access Time :
25 ns
Memory Size :
32kB
Mount :
Surface Mount
JESD-609 Code :
e0
I/O Type :
COMMON
Base Part Number :
IDT70V07
Max Supply Voltage :
3.6V
Lead Free :
Contains Lead
Width :
14mm
Address Bus Width :
30b
Time@Peak Reflow Temperature-Max (s) :
20
Terminal Pitch :
0.65mm
Pin Count :
80
Datasheets
70V07S25PF
Introducing Memory Intersil (Renesas Electronics Corporation) 70V07S25PF from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:TQFP, Operating Temperature:0°C ~ 70°C (TA), Number of Pins:80, Number of Terminations:80, Mounting Type:Surface Mount, Base Part Number:IDT70V07, 70V07S25PF pinout, 70V07S25PF datasheet PDF, 70V07S25PF amp .Beyond Memory Intersil (Renesas Electronics Corporation) 70V07S25PF ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 70V07S25PF


Memory Intersil (Renesas Electronics Corporation) 70V07S25PF Overview

The Memory Intersil (Renesas Electronics Corporation) 70V07S25PF is a high-performance 256Kbit SRAM designed in a compact 80TQFP package, engineered for advanced parallel communication. This product caters to the needs of high-speed applications requiring a reliable temporary storage mechanism. The integration of leading-edge technology by Intersil, now part of Renesas Electronics Corporation, ensures low power consumption while maintaining fast access times, making it an ideal choice for enhancing the performance and efficiency of embedded systems.

70V07S25PF Features

The 70V07S25PF boasts several key features that make it a robust choice for various demanding applications. These include a large 256Kbit capacity for substantial data handling, a parallel interface for high-speed data transfer, and a compact 80TQFP package that fits seamlessly into space-constrained applications. Additionally, the device's design focuses on low power operation to extend the life of battery-powered devices.

70V07S25PF Applications

  • Telecommunications Equipment: Utilized for buffering data in routers and switches, enhancing the efficiency and speed of data traffic management.
  • Industrial Control Systems: Acts as a fast-access data buffer in complex machinery controllers, enabling quicker processing and response times in automation processes.
  • Automotive Electronics: Integrated into automotive infotainment systems to provide rapid access to media and navigation data, improving user experience and system responsiveness.
  • Portable Devices: Employed in mobile devices where power efficiency and space-saving are crucial, helping to optimize performance and extend battery life.
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