70T3539MS133BC8

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Mfr.Part #
70T3539MS133BC8
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
256-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 256CABGA
Stock
21,807
In Stock :
21,807

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Memory Format :
SRAM
Packaging :
Tape and Reel (TR)
RoHS Status :
Non-RoHS Compliant
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Package / Case :
256-LBGA
Supplier Device Package :
256-CABGA (17x17)
Memory Size :
18Mb 512K x 36
Memory Interface :
Parallel
Mounting Type :
Surface Mount
Base Part Number :
IDT70T3539M
Operating Temperature :
0°C~70°C TA
Voltage - Supply :
2.4V~2.6V
Memory Type :
Volatile
Access Time :
4.2ns
Clock Frequency :
133MHz
Factory Lead Time :
13 Weeks
Datasheets
70T3539MS133BC8
Introducing Memory Intersil (Renesas Electronics Corporation) 70T3539MS133BC8 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:256-LBGA, Mounting Type:Surface Mount, Base Part Number:IDT70T3539M, Operating Temperature:0°C~70°C TA, 70T3539MS133BC8 pinout, 70T3539MS133BC8 datasheet PDF, 70T3539MS133BC8 amp .Beyond Memory Intersil (Renesas Electronics Corporation) 70T3539MS133BC8 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 70T3539MS133BC8


Memory Intersil (Renesas Electronics Corporation) 70T3539MS133BC8 Overview

The Memory Intersil (Renesas Electronics Corporation) 70T3539MS133BC8 is a high-performance 18Mbit SRAM designed to meet the demanding needs of high-speed data-intensive applications. This integrated circuit is encapsulated in a 256CABGA package, ensuring robust performance and reliability. It is engineered to provide quick parallel access to data, making it an ideal choice for advanced computing and processing tasks. This SRAM component is designed to support a wide range of applications, from complex digital signal processing to high-speed networking, offering manufacturers the flexibility and speed required to enhance product performance and efficiency.

70T3539MS133BC8 Features

The 70T3539MS133BC8 IC SRAM from Intersil (Renesas Electronics Corporation) includes several key features that make it stand out in the memory module market. Primarily, its 18Mbit storage capacity allows for substantial data handling capabilities in a compact form factor. The use of a 256CABGA package ensures high density and reliability, crucial for embedded systems and other high-integration environments. Furthermore, the parallel interface facilitates faster data transfer rates, which is essential for applications requiring rapid access to large volumes of data.

70T3539MS133BC8 Applications

  • Advanced Computing Systems: Utilizes its high-speed parallel access to enhance processing capabilities in servers and high-performance computers.
  • Networking Equipment: Acts as a buffer memory in routers and switches, facilitating efficient data flow and improving network traffic management.
  • Industrial Automation: Supports reliable and fast data handling in automated production lines, critical for real-time control systems.
  • Telecommunications Infrastructure: Helps manage data packets efficiently in telecommunications hardware, enhancing the performance of communication networks.
  • Aerospace and Defense: Provides robust, reliable data storage and access necessary for critical aerospace and defense applications, where performance and durability are paramount.
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