70T3339S133BFI
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- Mfr.Part #
- 70T3339S133BFI
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- 208-LFBGA
- Datasheet
- Download
- Description
- IC SRAM 9MBIT PARALLEL 208CABGA
- Stock
- 28,008
- In Stock ：
- 28,008
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- Memory
- Access Time :
- 4.2ns
- Mounting Type :
- Surface Mount
- Voltage - Supply :
- 2.4V~2.6V
- Factory Lead Time :
- 12 Weeks
- Base Part Number :
- IDT70T3339
- RoHS Status :
- ROHS3 Compliant
- Package / Case :
- 208-LFBGA
- Memory Interface :
- Parallel
- Memory Size :
- 9Mb 512K x 18
- Memory Type :
- Volatile
- Memory Format :
- SRAM
- Operating Temperature :
- -40°C~85°C TA
- Supplier Device Package :
- 208-CABGA (15x15)
- Clock Frequency :
- 133MHz
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Packaging :
- Tray
- Datasheets
- 70T3339S133BFI
Memory Intersil (Renesas Electronics Corporation) 70T3339S133BFI Overview
The Intersil (Renesas Electronics Corporation) 70T3339S133BFI is a high-performance IC SRAM component designed to meet the rigorous demands of advanced digital systems. With a storage capacity of 9MBIT and packaged in a robust 208CABGA format, this memory device offers unparalleled stability and speed for critical applications. The Memory Intersil (Renesas Electronics Corporation) 70T3339S133BFI is engineered to provide reliable and swift data access, making it an ideal choice for systems requiring high-speed memory operations and substantial data bandwidth.
70T3339S133BFI Features
The 70T3339S133BFI SRAM IC features a parallel interface, enabling quick data transfer rates and easy integration into existing architectures. This IC is tailored to operate efficiently under a wide range of environmental conditions, thereby ensuring consistent performance. The compact 208CABGA package not only minimizes space on the circuit board but also enhances the thermal management of the device, contributing to its overall reliability and longevity.
70T3339S133BFI Applications
- Advanced Computing Systems: Utilized in server memory banks and high-performance computing clusters for fast data retrieval and storage, ensuring efficient processing and handling of large datasets.
- Networking Equipment: Acts as buffer memory in routers and switches, enhancing packet transmission efficiency and network reliability.
- Telecommunication Infrastructure: Supports telecommunications systems by providing high-speed temporary data storage for signal processing applications, which is critical for maintaining high data integrity and speed.
- Industrial Automation: Used in control systems for real-time processing and data logging, improving operational efficiency and machine response times in automated production lines.
- Aerospace and Defense: Serves in avionics and military technology as a reliable memory solution capable of withstanding extreme conditions, essential for mission-critical applications where data integrity is paramount.
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