70T3319S200BC8

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Mfr.Part #
70T3319S200BC8
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
256-LBGA
Datasheet
Download
Description
IC SRAM 4.5MBIT PAR 256CABGA
Stock
26,659
In Stock :
26,659

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Access Time :
3.4ns
Package / Case :
256-LBGA
RoHS Status :
Non-RoHS Compliant
Clock Frequency :
200MHz
Supplier Device Package :
256-CABGA (17x17)
Memory Size :
4.5Mb 256K x 18
Operating Temperature :
0°C~70°C TA
Memory Type :
Volatile
Memory Interface :
Parallel
Factory Lead Time :
12 Weeks
Packaging :
Tape and Reel (TR)
Voltage - Supply :
2.4V~2.6V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Mounting Type :
Surface Mount
Base Part Number :
IDT70T3319
Memory Format :
SRAM
Datasheets
70T3319S200BC8
Introducing Memory Intersil (Renesas Electronics Corporation) 70T3319S200BC8 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:256-LBGA, Operating Temperature:0°C~70°C TA, Mounting Type:Surface Mount, Base Part Number:IDT70T3319, 70T3319S200BC8 pinout, 70T3319S200BC8 datasheet PDF, 70T3319S200BC8 amp .Beyond Memory Intersil (Renesas Electronics Corporation) 70T3319S200BC8 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 70T3319S200BC8


Memory Intersil (Renesas Electronics Corporation) 70T3319S200BC8 Overview

The Memory Intersil (Renesas Electronics Corporation) 70T3319S200BC8 is a cutting-edge SRAM (Static Random-Access Memory) designed for high-performance applications requiring rapid access to large volumes of data. With a generous 4.5Mbit capacity, this IC (Integrated Circuit) stands out for its robust packaging in a 256CABGA (Ceramic Ball Grid Array) format, offering excellent durability and thermal stability. Its high-speed functionality and reliability make it an ideal choice for industries demanding substantial data buffering and storage solutions in compact form factors.

70T3319S200BC8 Features

This SRAM module from Intersil (Renesas Electronics Corporation) offers significant advantages for systems requiring fast and stable memory operations. Key features include parallel interface for simplified integration, large 4.5Mbit storage capacity for extensive data handling, and the 256CABGA package that ensures robust performance in harsh environments. These characteristics make the 70T3319S200BC8 not only powerful but also remarkably efficient and dependable in complex electronic assemblies.

70T3319S200BC8 Applications

  • Advanced Telecommunications Equipment: Utilized for high-speed data buffering in routers and switches, ensuring efficient data flow and reduced latency in network infrastructure.
  • Industrial Automation Systems: Serves as a reliable memory solution for PLCs (Programmable Logic Controllers) and other automation equipment, where quick data access is crucial for real-time process control.
  • Aerospace and Defense: Provides dependable and robust data storage for applications in avionic systems and military electronics, where failure is not an option.
  • Medical Imaging Devices: Supports the high data throughput required for advanced medical imaging technologies, such as MRI and CT scanners, improving diagnostic capabilities.
  • Automotive Electronics: Enhances performance in car infotainment systems and driver assist technologies by allowing rapid access to information, thus increasing safety and user experience.
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