709279L12PF8

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Mfr.Part #
709279L12PF8
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
TQFP
Datasheet
Download
Description
IC SRAM 512KBIT PARALLEL 100TQFP
Stock
40,175
In Stock :
40,175

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Access Time :
12 ns
Number of Ports :
2
Base Part Number :
IDT709279
Supply Voltage :
5V
Min Operating Temperature :
0°C
I/O Type :
COMMON
Radiation Hardening :
No
Lead Free :
Contains Lead
Operating Supply Voltage :
5V
Write Cycle Time - Word, Page :
--
Packaging :
Tape and Reel (TR)
Memory Size :
64KB
Package / Case :
TQFP
Terminal Form :
Gull wing
Standby Current-Max :
0.005A
Memory Type :
RAM, SDR, SRAM
Series :
--
Address Bus Width :
15b
Width :
14mm
Power Supplies :
5V
Number of Pins :
100
Other Names :
IDT709279L12PF8 IDT709279L12PF8-ND
Density :
512 kb
Pbfree Code :
No
Thickness :
1.4mm
Memory Interface :
Parallel
Max Supply Voltage :
5.5V
Number of Functions :
1
Memory Format :
SRAM
Interface :
Parallel
Additional Feature :
FLOW-THROUGH OR PIPELINED ARCHITECTURE
Voltage - Supply :
4.5 V ~ 5.5 V
Number of Terminations :
100
Output Characteristics :
3-STATE
Supplier Device Package :
100-TQFP (14x14)
Mount :
Surface Mount
Published :
2009
Temperature Grade :
COMMERCIAL
Terminal Pitch :
0.5mm
JESD-609 Code :
e0
Sync/Async :
SYNCHRONOUS
Peak Reflow Temperature (Cel) :
240
RoHS Status :
RoHS Compliant
Terminal Finish :
Tin/Lead (Sn85Pb15)
Time@Peak Reflow Temperature-Max (s) :
20
Height Seated (Max) :
1.6mm
Word Size :
16b
Max Operating Temperature :
70°C
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Nominal Supply Current :
305mA
Frequency :
33.3MHz
Pin Count :
100
Min Supply Voltage :
4.5V
Operating Temperature :
0°C ~ 70°C (TA)
Mounting Type :
Surface Mount
Terminal Position :
QUAD
Factory Lead Time :
7 Weeks
Length :
14mm
Datasheets
709279L12PF8
Introducing Memory Intersil (Renesas Electronics Corporation) 709279L12PF8 from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:IDT709279, Package / Case:TQFP, Number of Pins:100, Number of Terminations:100, Operating Temperature:0°C ~ 70°C (TA), Mounting Type:Surface Mount, 709279L12PF8 pinout, 709279L12PF8 datasheet PDF, 709279L12PF8 amp .Beyond Memory Intersil (Renesas Electronics Corporation) 709279L12PF8 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 709279L12PF8


Memory Intersil (Renesas Electronics Corporation) 709279L12PF8 Overview

Explore the innovative capabilities of the Memory Intersil (Renesas Electronics Corporation) 709279L12PF8, a cutting-edge IC SRAM 512KBIT PARALLEL housed in a 100TQFP package. Designed with meticulous precision and crafted for optimal performance, this product embodies reliability, efficiency, and versatility.

With a focus on meeting the demanding requirements of B2B clientele, this SRAM solution sets a new standard in memory technology. Its robust architecture ensures seamless integration into a wide range of applications, empowering businesses with the tools they need to excel in today's competitive landscape.

709279L12PF8 Features

  • High-Speed Operation: Experience lightning-fast data access and retrieval with this IC's impressive speed capabilities.
  • Large Capacity: With 512KBIT of memory, this SRAM provides ample storage for critical data and information.
  • Parallel Interface: Facilitating efficient communication, the parallel interface enhances connectivity and throughput.
  • Compact Form Factor: The 100TQFP package ensures space-saving design without compromising performance.
  • Reliable Performance: Built to withstand rigorous operational demands, this IC delivers consistent and reliable performance.

709279L12PF8 Applications

  • Industrial Automation: Implement reliable data storage and retrieval mechanisms in industrial automation systems for enhanced efficiency and productivity.
  • Telecommunications Infrastructure: Power telecommunications infrastructure with high-speed data processing capabilities, ensuring seamless communication networks.
  • Medical Devices: Enhance the functionality of medical devices such as patient monitoring systems with secure and efficient data storage solutions.
  • Automotive Electronics: Enable advanced features in automotive electronics, including navigation systems and driver assistance technologies, with reliable memory storage.
  • Consumer Electronics: Elevate the performance of consumer electronics devices such as gaming consoles and smart appliances with high-speed memory solutions.
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Shipping Cost

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